參數(shù)資料
型號: 935288885112
廠商: NXP SEMICONDUCTORS
元件分類: 網(wǎng)絡(luò)接口
英文描述: DATACOM, INTERFACE CIRCUIT, PDSO8
封裝: 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8
文件頁數(shù): 3/24頁
文件大?。?/td> 214K
代理商: 935288885112
2000 Jan 13
11
Philips Semiconductors
Product specication
CAN transceiver for 24 V systems
PCA82C251
BONDING PAD LOCATIONS
Note
1. All coordinates (
m) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the die (x/y = 0).
SYMBOL
PAD
COORDINATES(1)
xy
TXD
1
196
137
GND
2
1080
137
VCC
3
1567
137
RXD
4
2644
137
Vref
5
2644
1644
CANL
6
1490
1644
CANH
7
748
1644
Rs
8
200
1610
handbook, full pagewidth
PCA82C251U
1
TXD
8
Rs
7
CANH
6
CANL
5
V
ref
V
CC
2
GND
34
RXD
MGL944
y
2.84 mm
x
0
1.78
mm
Fig.10 Bonding pad locations.
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