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參數(shù)資料
| 型號： | 93LC56BXT-I/STG |
| 元件分類： | PROM |
| 英文描述： | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
| 封裝： | 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8 |
| 文件頁數(shù)： | 13/28頁 |
| 文件大?。?/td> | 421K |
| 代理商： | 93LC56BXT-I/STG |
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93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
DS21794C-page 20
2005 Microchip Technology Inc.
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
Exposed Pad Width
Exposed Pad Length
Contact Length
*Controlling Parameter
Contact Width
Drawing No. C04-123
Notes:
Exposed pad dimensions vary with paddle size.
Overall Width
E2
D2
L
b
E
.016
.012
.008
.047
.055
.010
.118 BSC
Number of Pins
Standoff
Contact Thickness
Overall Length
Overall Height
Pitch
p
n
Units
A
A1
D
A3
Dimension Limits
8
.000
.001
.008 REF.
.079 BSC
.031
.020 BSC
MIN
INCHES
NOM
0.40
0.25
3.00 BSC
0.30
.020
.071
.012
.064
0.20
1.20
1.39
0.50
0.30
1.80
1.62
0.02
0.80
2.00 BSC
0.20 REF.
0.50 BSC
MILLIMETERS*
.002
.039
0.00
MIN
MAX
NOM
8
0.05
1.00
MAX
3.
Package may have one or more exposed tie bars at ends.
1.
Pin 1 visual index feature may vary, but must be located within the hatched area.
2.
0.90
.035
(Note 3)
4. JEDEC equivalent: MO-229
L
E2
A3
A1
A
TOP VIEW
D
E
EXPOSED
PAD
METAL
D2
BOTTOM VIEW
21
b
p
n
(NOTE 1)
EXPOSED
TIE BAR
PIN 1
(NOTE 2)
ID INDEX
AREA
Revised 05/24/04
--
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 93AA56BXT-I/STG | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
| 93AA56CXT-I/STG | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
| 93LC56AXT-I/STG | 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
| 93LC56CX-I/MSG | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
| 93C56BX-I/PG | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 93LC56C | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:2K Microwire Compatible Serial EEPROM |
| 93LC56C/S15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C/W15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C/WF15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C-E/CH | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs |
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