參數(shù)資料
型號(hào)： 93LC56BXTI/SN
元件分類： PROM
英文描述： 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
封裝： 0.150 INCH, ROHS COMPLIANT, PLASTIC, MS-012, SOIC-8
文件頁(yè)數(shù)： 11/28頁(yè)
文件大?。?/td> 468K
代理商： 93LC56BXTI/SN
2007 Microchip Technology Inc.
DS21794E-page 19
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
0.65 BSC
Overall Height
A
–
1.20
Molded Package Thickness
A2
0.80
1.00
1.05
Standoff
A1
0.05
–
0.15
Overall Width
E
6.40 BSC
Molded Package Width
E1
4.30
4.40
4.50
Molded Package Length
D
2.90
3.00
3.10
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.19
–
0.30
D
N
E
E1
NOTE 1
12
b
e
c
A
A1
A2
L1
L
φ
Microchip Technology Drawing C04-086B
相關(guān)PDF資料
PDF描述
93AA56BX-E/MS 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA56AXT-E/SN 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA56AX-E/MC 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA56AXT-E/MC 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA56CX-E/OT 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO6
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
93LC56C 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:2K Microwire Compatible Serial EEPROM
93LC56C/S15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93LC56C/W15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93LC56C/WF15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93LC56C-E/CH 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs
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