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參數(shù)資料
| 型號(hào)： | 950-3 |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 12/12頁 |
| 文件大小： | 200K |
| 代理商： | 950-3 |
M/A-COM, Inc.
North America:
Tel. (800) 366-2266
s
Asia/Pacific:
Tel. +85 2 2375 0618
s
Europe: Tel. +44 (1344) 869 595
Fax (800) 618-8883
Fax +85 2 2375 0350
Fax +44 (1344) 300 020
9
Specifications Subject to Change Without Notice.
OSMT ApplicationNotes
Automatic Placement cont’d.
Soldering
Alignment/centering grippers should contact sides of plug above con-
tact leads as shown below:
Figure 3
Typical Alignment/Centering Grippers
Alignment/centering gripper pressure should not exceed 400g.
OSMT plug receptacles are designed for reflow soldering processes,
however excellent results can still be achieved using manual solder-
ing. Flow (wave) soldering is not appropriate for this device.
The type of solder paste selected for reflow soldering is generally a
function of many factors relative to the overall system (PWA*) design.
Most applications will use common electronic grade solders such as:
63/37, 60/40 or 62/36/2 with mild rosin/resin fluxes. Metal content of
the paste for screen and/or stencil applications is generally 85-90% by
weight, slightly lower for nozzel dispensing applications.
When screening or stenciling, solder paste thickness of .15mm (.006
inch) to .25mm (.010 inch) is recommended.
OSMT plug receptacles can be reflow soldered using infrared (IR),
convection or vapor phase (VP) heating equipment. It is recom-
mended that peak reflow temperature be approximately 10-30°C
(20-55°F) above solder liquidus temperature. Typical reflow tempera-
ture profiles are shown below:
Figure 4
Typical Infrared and Convection Heating/Soldering Profile
* Printed Wiring Assembly
TEMP
°C
250
200
150
100
50
SOLDER
PASTE
CURE
30-60 SEC
50-100
°C
AMBIENT OR
FORCED
COOL DOWN
REFLOW
20 - 40 SEC
AT 235
°C TYP.
240 - 250
°C MAX
PREHEAT
FLUX MELT/ACTIVATION
SOLDER SPHERE MELT BEGINS
60 - 90 SEC AT 100 - 200
°C
Decimal inch equivalents are shown in parentheses for general information only.
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