A3 22 00 DX Ti m i n g Ch ar ac te r i st i c s (continued) (Wor s t - C as e M i l" />
參數(shù)資料
型號: A1010B-PL68C
廠商: Microsemi SoC
文件頁數(shù): 50/98頁
文件大?。?/td> 0K
描述: IC FPGA 1200 GATES 68-PLCC COM
標(biāo)準(zhǔn)包裝: 19
系列: ACT™ 1
LAB/CLB數(shù): 295
輸入/輸出數(shù): 57
門數(shù): 1200
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 68-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 68-PLCC(24.23x24.23)
54
A3 22 00 DX Ti m i n g Ch ar ac te r i st i c s (continued)
(Wor s t - C as e M i l i t a r y Cond i t i o n s , V CC = 4.5 V, TJ = 1 25°C)
‘–1’ Speed
‘Std’ Speed
Parameter
Description
Min.
Max.
Min.
Max.
Units
Input Module Propagation Delays
tINPY
Input Data Pad to Y
1.9
2.6
ns
tINGO
Input Latch Gate-to-Output
4.6
6.0
ns
tINH
Input Latch Hold
0.0
ns
tINSU
Input Latch Setup
0.7
0.9
ns
tILA
Latch Active Pulse Width
6.1
8.1
ns
Input Module Predicted Routing Delays1
tIRD1
FO=1 Routing Delay
2.6
3.5
ns
tIRD2
FO=2 Routing Delay
3.4
4.6
ns
tIRD3
FO=3 Routing Delay
4.6
6.1
ns
tIRD4
FO=4 Routing Delay
5.4
7.2
ns
tIRD5
FO=8 Routing Delay
7.0
9.3
ns
Global Clock Network
tCKH
Input Low to High
FO=32
FO=635
7.3
8.5
9.8
11.3
ns
tCKL
Input High to Low
FO=32
FO=635
7.2
9.3
9.6
12.5
ns
tPWH
Minimum Pulse Width High
FO=32
FO=635
3.2
3.9
4.3
5.2
ns
tPWL
Minimum Pulse Width Low
FO=32
FO=635
3.2
3.9
4.3
5.2
ns
tCKSW
Maximum Skew
FO=32
FO=635
1.8
2.4
ns
tSUEXT
Input Latch External Setup
FO=32
FO=635
0.0
ns
tHEXT
Input Latch External Hold
FO=32
FO=635
3.0
3.8
4.0
5.1
ns
tP
Minimum Period (1/fmax)
FO=32
FO=635
5.8
6.8
7.7
9.1
ns
fHMAX
Maximum Datapath Frequency
FO=32
FO=635
172
147
130
110
MHz
Note:
1.
Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device
performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is
based on actual routing delay measurements performed on the device prior to shipment. Optimization techniques may further reduce
delays by 0 to 4 ns.
相關(guān)PDF資料
PDF描述
RMM36DTMT-S273 CONN EDGECARD 72POS R/A .156 SLD
RSM36DTMT-S273 CONN EDGECARD 72POS R/A .156 SLD
A40MX04-3PLG68I IC FPGA MX SGL CHIP 6K 68-PLCC
A40MX04-3PL68I IC FPGA MX SGL CHIP 6K 68-PLCC
A54SX16A-2TQG144I IC FPGA SX 24K GATES 144-TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A1010B-PL68CX40 制造商:Microsemi Corporation 功能描述:FPGA
A1010B-PL68I 功能描述:IC FPGA 1200 GATES 68-PLCC IND RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ACT™ 1 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A1010B-PLG44C 功能描述:IC FPGA 1200 GATES 44-PLCC COM RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ACT™ 1 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A1010B-PLG44I 功能描述:IC FPGA 1200 GATES 44-PLCC IND RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ACT™ 1 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A1010B-PLG68C 功能描述:IC FPGA 1200 GATES 68-PLCC COM RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ACT™ 1 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)