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參數(shù)資料
| 型號： | A1240A-PLG84C |
| 廠商： | Microsemi SoC |
| 文件頁數(shù)： | 2/54頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 4K GATES 84-PLCC COM |
| 標準包裝： | 16 |
| 系列： | ACT™ 2 |
| LAB/CLB數(shù)： | 684 |
| 輸入/輸出數(shù)： | 72 |
| 門數(shù)： | 4000 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 84-LCC（J 形引線） |
| 供應商設備封裝： | 84-PLCC（29.31x29.31） |
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Detailed Specifications
2- 4
R e v ision 8
Static Power Component
Microsemi FPGAs have small static power components that result in lower power dissipation than PALs
or PLDs. By integrating multiple PALs/PLDs into one FPGA, an even greater reduction in board-level
power dissipation can be achieved.
The power due to standby current is typically a small component of the overall power. Standby power is
calculated in Table 2-5 for commercial, worst case conditions.
The static power dissipated by TTL loads depends on the number of outputs driving high or low and the
DC load current. Again, this value is typically small. For instance, a 32-bit bus sinking 4 mA at 0.33 V will
generate 42 mW with all outputs driving low, and 140 mW with all outputs driving high. The actual
dissipation will average somewhere between as I/Os switch states with time.
Active Power Component
Power dissipation in CMOS devices is usually dominated by the active (dynamic) power dissipation. This
component is frequency dependent, a function of the logic and the external I/O. Active power dissipation
results from charging internal chip capacitances of the interconnect, unprogrammed antifuses, module
inputs, and module outputs, plus external capacitance due to PC board traces and load device inputs.
An additional component of the active power dissipation is the totem-pole current in CMOS transistor
pairs. The net effect can be associated with an equivalent capacitance that can be combined with
frequency and voltage to represent active power dissipation.
Equivalent Capacitance
The power dissipated by a CMOS circuit can be expressed by EQ 3.
Power (W) = CEQ * VCC2 * F
EQ 3
Where:
CEQ is the equivalent capacitance expressed in pF.
VCC is the power supply in volts.
F is the switching frequency in MHz.
Equivalent capacitance is calculated by measuring ICC active at a specified frequency and voltage for
each circuit component of interest. Measurements have been made over a range of frequencies at a
fixed value of VCC. Equivalent capacitance is frequency independent so that the results may be used
over a wide range of operating conditions. Equivalent capacitance values are shown in Table 2-6.
Table 2-5 Standby Power Calculation
ICC
VCC
Power
2 mA
5.25 V
10.5 mW
Table 2-6 CEQ Values for Microsemi FPGAs
Item
CEQ Value
Modules (CEQM)
5.8
Input Buffers (CEQI)
12.9
Output Buffers (CEQO)
23.8
Routed Array Clock Buffer Loads (CEQCR)3.9
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| A1240A-PLG84I | 功能描述:IC FPGA 4K GATES 84-PLCC IND RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ACT™ 2 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應商設備封裝:352-CQFP（75x75） |
| A1240A-PQ144C | 功能描述:IC FPGA 4K GATES 144-PQFP COM RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ACT™ 2 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應商設備封裝:352-CQFP（75x75） |
| A1240A-PQ144I | 功能描述:IC FPGA 4K GATES 144-PQFP IND RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ACT™ 2 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應商設備封裝:352-CQFP（75x75） |
| A1240A-PQ144M | 制造商:Microsemi Corporation 功能描述:FPGA ACT 2 Family 4K Gates 684 Cells 90MHz 1.0um Technology 5V 144-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA ACT 2 4K GATES 684 CELLS 90MHZ 1.0UM 5V 144PQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 4K GATES 144-PQFP MIL |
| A1240A-PQ160B | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:ACT 2 Family FPGAs |
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