參數(shù)資料
型號: A1323EUA-T
元件分類: 磁阻傳感器
英文描述: MAGNETIC FIELD SENSOR-HALL EFFECT, 0.20-4.70V, RECTANGULAR, THROUGH HOLE MOUNT
封裝: LEAD FREE, SIP-3
文件頁數(shù): 2/12頁
文件大小: 277K
代理商: A1323EUA-T
Ratiometric Linear Hall Effect Sensor
for High-Temperature Operation
A1321, A1322,
and
A1323
10
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Power Derating
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating sup-
plied power or improving the heat dissipation properties of the
application. This section presents a procedure for correlating
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.)
The Package Thermal Resistance, RJA, is a gure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, RJC, is
relatively small component of RJA. Ambient air temperature,
TA, and air motion are signicant external factors, damped by
overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN
× IIN
(1)
T = PD
× RJA (2)
TJ = TA + ΔT
(3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 4 mA, and RJA = 140 °C/W, then:
PD = VCC
× ICC = 12 V × 4 mA = 48 mW
T = PD
× RJA = 48 mW × 140 °C/W = 7°C
TJ = TA + T = 25°C + 7°C = 32°C
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding TJ(max),
at a selected RJA and TA.
Example: Reliability for VCC at TA=150°C, package UA, using
minimum-K PCB.
Observe the worst-case ratings for the device, specically:
RJA=165°C/W, TJ(max) =165°C, VCC(max)= 5.5 V, and
ICC(max) = 8 mA.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
Tmax = TJ(max) – TA = 165°C–150°C = 15°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = Tmax÷RJA =15°C÷165 °C/W=91mW
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ÷ ICC(max)= 91mW÷8mA=11.4 V
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-
able operation between VCC(est) and VCC(max) requires enhanced
RJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
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