參數(shù)資料
型號： A1460A-TQ176I
廠商： Microsemi SoC
文件頁數(shù)： 4/90頁
文件大?。?/td> 0K
描述： IC FPGA 6K GATES 176-TQFP
標準包裝： 40
系列： ACT™ 3
LAB/CLB數(shù)： 848
輸入/輸出數(shù)： 151
門數(shù)： 6000
電源電壓： 4.5 V ~ 5.5 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 85°C
封裝/外殼： 176-LQFP
供應商設備封裝： 176-TQFP（24x24）
Detailed Specifications
2- 4
R e v ision 3
The I/O module output Y is used to bring Pad signals into the array or to feed the output register back into
the array. This allows the output register to be used in high-speed state machine applications. Side I/O
modules have a dedicated output segment for Y extending into the routing channels above and below
(similar to logic modules). Top/Bottom I/O modules have no dedicated output segment. Signals coming
into the chip from the top or bottom are routed using F-fuses and LVTs (F-fuses and LVTs are explained
in detail in the routing section).
I/O Pad Drivers
All pad drivers are capable of being tristate. Each buffer connects to an associated I/O module with four
signals: OE (Output Enable), IE (Input Enable), DataOut, and DataIn. Certain special signals used only
during programming and test also connect to the pad drivers: OUTEN (global output enable), INEN
(global input enable), and SLEW (individual slew selection). See Figure 2-5.
Special I/Os
The special I/Os are of two types: temporary and permanent. Temporary special I/Os are used during
programming and testing. They function as normal I/Os when the MODE pin is inactive. Permanent
special I/Os are user programmed as either normal I/Os or special I/Os. Their function does not change
once the device has been programmed. The permanent special I/Os consist of the array clock input
buffers (CLKA and CLKB), the hard-wired array clock input buffer (HCLK), the hard-wired I/O clock input
buffer (IOCLK), and the hard-wired I/O register preset/clear input buffer (IOPCL). Their function is
determined by the I/O macros selected.
Clock Networks
The ACT 3 architecture contains four clock networks: two high-performance dedicated clock networks
and two general purpose routed networks. The high-performance networks function up to 200 MHz,
while the general purpose routed networks function up to 150 MHz.
Figure 2-5
Function Diagram for I/O Pad Driver
PAD
OE
SLEW
DATAOUT
DATAIN
IEN
INEN
OUTEN
相關PDF資料
PDF描述
A1460A-TQG176I IC FPGA 6K GATES 176-TQFP
FMM22DSEF-S13 CONN EDGECARD 44POS .156 EXTEND
FMM22DRKF-S13 CONN EDGECARD 44POS .156 EXTEND
EP1S25B672C7 IC STRATIX FPGA 25K LE 672-BGA
APA750-FG676I IC FPGA PROASIC+ 750K 676-FBGA
相關代理商/技術參數(shù)
參數(shù)描述
A1460A-TQG176C 功能描述:IC FPGA 6K GATES 176-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ACT™ 3 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應商設備封裝:352-CQFP（75x75）
A1460A-TQG176I 功能描述:IC FPGA 6K GATES 176-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ACT™ 3 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應商設備封裝:352-CQFP（75x75）
A1460B-1BG225C 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
A1460B-1PQ160C 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
A1460B-1PQ160I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*