參數(shù)資料
型號: A14V60A-TQ176C
廠商: Microsemi SoC
文件頁數(shù): 34/90頁
文件大?。?/td> 0K
描述: IC FPGA 6K GATES 3.3V 176-TQFP
標準包裝: 40
系列: ACT™ 3
LAB/CLB數(shù): 848
輸入/輸出數(shù): 151
門數(shù): 6000
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 176-LQFP
供應商設備封裝: 176-TQFP(24x24)
Accelerator Series FPGAs – ACT 3 Family
IV
Re vis i on 3
A14V40A Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
–––
––
100-Pin Very Thin Quad Flatpack (VQFP)
–––
––
160-Pin Plastic Quad Flatpack (PQFP)
–––
––
176-Pin Thin Quad Flatpack (TQFP)
–––
––
A1460A Device
160-Pin Plastic Quad Flatpack (PQFP)
DD
––
176-Pin Thin Quad Flatpack (TQFP)
DD
––
196-Pin Ceramic Quad Flatpack (CQFP)
––
207-Pin Ceramic Pin Grid Array (CPGA)
DD
208-Pin Plastic Quad Flatpack (PQFP)
DD
––
225-Pin Plastic Ball Grid Array (BGA)
D
––
A14V60A Device
160-Pin Plastic Quad Flatpack (PQFP)
–––
––
176-Pin Thin Quad Flatpack (TQFP)
–––
––
208-Pin Plastic Quad Flatpack (PQFP)
–––
––
A14100A Device
208-Pin Power Quad Flatpack (RQFP)
DD
––
257-Pin Ceramic Pin Grid Array (CPGA)
DD
313-Pin Plastic Ball Grid Array (BGA)
DD
––
256-Pin Ceramic Quad Flatpack (CQFP)
––
A14V100A Device
208-Pin Power Quad Flatpack (RQFP)
–––
––
313-Pin Plastic Ball Grid Array (BGA)
–––
––
Device/Package
Speed Grade1
Application1
Std.
–1
–2
–3
C
I
M
B
Notes:
1. Applications:
C = Commercial
I = Industrial
M = Military
2. Commercial only
Availability:
= Available
P = Planned
– = Not planned
D = Discontinued
Speed Grade:
–1 = Approx. 15% faster than Std.
–2 = Approx. 25% faster than Std.
–3 = Approx. 35% faster than Std.
(–2 and –3 speed grades have
been discontinued.)
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A14V60A-TQG176C 功能描述:IC FPGA 6K GATES 3.3V 176-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ACT™ 3 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應商設備封裝:352-CQFP(75x75)
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