參數(shù)資料
型號(hào): A32400DX-2BG313C
元件分類: FPGA
英文描述: FPGA, 2526 CLBS, 40000 GATES, PBGA313
封裝: BGA-313
文件頁數(shù): 12/22頁
文件大小: 217K
代理商: A32400DX-2BG313C
2
timing analysis, user programming, and debug and diagnostic
probe capabilities. In addition, Designer 3.0 provides the
DirectTime tool which provides deterministic as well as
controllable timing. DirectTime allows the designer to
specify the performance requirements of individual paths and
system clock(s). Using these specifications, the software will
automatically optimize the placement and routing of the logic
to meet these constraints. Included with Designer 3.0 is
Actel’s ACTgen Macro Builder. ACTgen allows the
designer to quickly build fast, efficient logic functions such
as counters, adders, FIFOs, and RAM.
The Designer Series tools provide designers the capability to
move up to High-Level Description Languages, such as
VHDL and Verilog, or use schematic design entry with
interfaces to most EDA tools. Designer Series 3.0 is
supported on the following development platforms: 386/486
and Pentium PC, Sun and HP workstations. The software
provides CAE interfaces to Cadence, Escalade, Exemplar
Logic, IST, Mentor Graphics OrCAD, Synopsys, and
Viewlogic design environments. Additional development
tools are supported through Actel’s Industry Alliance
Program, including DATA I/O (ABEL FPGA) and MINC.
Actel’s FPGAs are an ideal solution for shortening the system
design and development cycle and offers a cost-effective
alternative for low volume production runs. The 3200DX
devices are an excellent choice for integrating logic that is
currently implemented in TTL, PALs, CPLDs and FPGAs.
Some example applications include high-speed controllers
and address decoding, peripheral bus interfaces, DSP, and
co-processor functions.
Device Resources
Package Definitions (Consult your local Actel Sales Representative for product availability.)
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, BGA = Ball Grid Array
Ordering Information
User I/Os
Device Series
PLCC
84-pin
PQFP
160-pin
PQFP
208-pin
PQFP
240-pin
TQFP
176-pin
BGA
225-pin
BGA
313-pin
A3265DX
72
125
126
A32100DX
72
125
156
151
156
A32140DX
125
176
151
176
A32200DX
176
TBD
TBD
206
A32300DX
TBD
254
A32400DX
TBD
TBD
Application (Temperature Range)
C = Commercial (0 to +70
°C)
I
= Industrial (–40 to +85
°C)
PP = Pre-Production
Package Type
PL = Plastic J-Leaded Chip Carrier
PQ = Plastic Quad Flatpack
TQ = Thin (1.4 mm) Quad Flatpack
RQ = Power Quad Flatpack
BG = Ball Grid Array
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% faster than Standard
–2 = Approximately 25% faster than Standard
Part Number
Package Lead Count
A32200
PQ
208
C
1
DX
Sub Family
相關(guān)PDF資料
PDF描述
A32400DX-2BG313I FPGA, 2526 CLBS, 40000 GATES, PBGA313
A32400DX-2PQ240C FPGA, 2526 CLBS, 40000 GATES, PQFP240
A32400DX-2PQ240I FPGA, 2526 CLBS, 40000 GATES, PQFP240
A32400DX-BG313C FPGA, 2526 CLBS, 40000 GATES, PBGA313
A32400DX-BG313I FPGA, 2526 CLBS, 40000 GATES, PBGA313
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