參數(shù)資料
型號: A3P060-FGG144
廠商: Microsemi SoC
文件頁數(shù): 23/27頁
文件大?。?/td> 0K
描述: IC FPGA 512MAC 96I/O 144FBGA
標(biāo)準(zhǔn)包裝: 160
系列: ProASIC3
RAM 位總計(jì): 18432
輸入/輸出數(shù): 96
門數(shù): 60000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 144-LBGA
供應(yīng)商設(shè)備封裝: 144-FPBGA(13x13)
其它名稱: 1100-1014
5
www.microsemi.com/soc
IntegratedA/Dconverter(ADC)
with8-,10-and12-bit
resolutionand30scalable
analog input channels
ADCaccuracybetterthan
1percent
On-chipvoltage,currentand
temperature monitors
In-systemconfigurable
analog supports a wide
varietyofapplications
Upto1MBofuserflashmemory
Extensiveclockingresources
AnalogPLLs
1percentRCoscillator
Crystaloscillatorcircuit
Real-timecounter(RTC)
FlashFPGAfabric
Reprogrammable
Liveatpower-up
Maximumdesignsecurity
Ultra-lowpower
Configurationmemoryerror
immune
Clockmanagement
AdvancedI/Ostandards
UsernonvolatileFlashROM
Notes:
1. Refer to the Cortex-M1 product brief for more information.
2. Pigeon Point devices only offered in FG484 and FG256 packages.
3. MicroBlade devices only offered in FG256 package.
Notes:
1. Pigeon Point devices only offered in FG484 and FG256 packages.
2. MicroBlade devices only offered in FG256 package.
3. These packages are available only as RoHS-compliant (QNG package specifier).
4. AFS250 and AFS600 PQ208 devices are not pin-compatible.
5. Available in RoHS-compliant and standard leaded packages.
Fusion
Package I/Os: Single-/Double-Ended (Analog)
Fusion Mixed Signal FPGAs
AFS090
AFS250
AFS600
AFS1500
Cortex-M1Devices
M1AFS250
M1AFS600
M1AFS1500
Pigeon Point Devices
P1AFS6001
P1AFS15001
MicroBladeDevices
U1AFS6002
QN1083
37/9 (16)
QN1803
60/16 (20)
65/15 (24)
PQ2084
93/26 (24)
95/46 (40)
FG2565
75/22 (20)
114/37 (24)
119/58 (40)
FG4845
172/86 (40)
223/109 (40)
FG6765
252/126 (40)
Fusion Devices
Theworld’sfirstmixedsignalFPGA
Fusion FPGAs integrate configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry and high-performance,
flash-based programmable logic in a monolithic device. The Fusion architecture can be used with soft microcontroller cores, such as the performance-optimized
ARM Cortex-M1, 8051s or Microsemi’s own CoreABC, the smallest soft microcontroller for FPGAs.
Fusion Devices
AFS090
AFS250
AFS600
AFS1500
Cortex-M1Devices1
M1AFS250
M1AFS600
M1AFS1500
Pigeon Point Devices
P1AFS6002
P1AFS15002
MicroBladeDevices
U1AFS6003
General
Information
System Gates
90,000
250,000
600,000
1,500,000
Tiles(D–flip–flops)
2,304
6,144
13,824
38,400
AES-protected ISP
Yes
PLLs
1
2
Globals
18
Memory
FlashMemoryBlocks(2Mbits)
1
2
4
TotalFlashMemoryBits
2 M
4 M
8 M
FlashROMBits
1,024
RAMBlocks(4,608bits)
6
8
24
60
RAM(Kbits)
27
36
108
270
Analog and I/Os
Analog Quads
5
6
10
Analog Input Channels
15
18
30
Gate Driver Outputs
5
6
10
I/OBanks(+JTAG)
4
5
Maximum Digital I/Os
75
114
172
252
Analog I/Os
20
24
40
Fusion
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A3P060-FGG144ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
A3P060-FGG144I 功能描述:IC FPGA 1KB FLASH 60K 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
A3P060-FGG144PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
A3P060-FGG144T 功能描述:IC FPGA 1KB FLASH 60K 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
A3P060-FPQ144 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs