December 2009
I
2010 Actel Corporation
Automotive ProASIC3 Flash Family FPGAs
Features and Benefits
High-Temperature AEC-Q100–Qualified Devices
Grade 2 105°C TA (115°C TJ)
Grade 1 125°C TA (135°C TJ)
PPAP Documentation
Firm-Error Immune
Only Automotive FPGAs to Offer Firm-Error Immunity
Can Be Used without Configuration Upset Risk
High Capacity
60 k to 1 M System Gates
Up to 144 kbits of SRAM
Up to 300 User I/Os
Reprogrammable Flash Technology
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Automotive Process
Live-at-Power-Up (LAPU) Level 0 Support
Single-Chip Solution
Retains Programmed Design when Powered Off
On-Chip User Nonvolatile Memory
1 kbit of FlashROM with Synchronous Interface
High Performance
350 MHz System Performance
3.3 V, 66 MHz 64-Bit PCI
In-System Programming (ISP) and Security
Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
FlashLock to Secure FPGA Contents (anti-tampering)
Low Power
1.5 V Core Voltage
Support for 1.5-V-Only Systems
Low-Impedance Flash Switches
High-Performance Routing Hierarchy
Segmented, Hierarchical Routing and Clock Structure
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
Advanced I/O
700 Mbps DDR, LVDS-Capable I/Os
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—up to 4 Banks per Chip
Single-Ended
I/O
Standards:
LVTTL,
LVCMOS
3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS
2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS (A3P250 and A3P1000)
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold-Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Weak Pull-Up/-Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages across the Automotive ProASIC3
Family
Clock Conditioning Circuit (CCC) and PLL
Six CCC Blocks, One with an Integrated PLL
Configurable Phase Shift, Multiply/Divide, Delay Capabilities,
and External Feedback
Wide Input Frequency Range (1.5 MHz up to 350 MHz)
SRAMs
Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
Table 1 Automotive ProASIC3 Product Family
ProASIC3 Devices
A3P060
A3P125
A3P250
A3P1000
System Gates
60 k
125 k
250 k
1 M
VersaTiles (D-flip-flops)
1,536
3,072
6,144
24,576
RAM kbits (1,024 bits)
18
36
144
4,608-Bit Blocks
4
8
32
FlashROM Bits
1 k
Secure (AES) ISP
Yes
Integrated PLL in CCCs
1111
VersaNet Globals1
18
I/O Banks
2244
Maximum User I/Os
96
133
157
300
Package Pins
VQFP
FBGA
QFN2
VQ100
FG144
VQ100
FG144
QNG132
VQ100
FG144, FG256
QNG132
FG144, FG256, FG484
Notes:
1. Six chip-wide (main) globals and three additional global networks in each quadrant are available.
2. QFN packages are available as RoHS compliant only.
Revision 1