1-2 Revision 13 Flash Advantages Low Power The ProASIC3L family of Microsemi flash-based FPGAs provide a l" />
參數(shù)資料
型號(hào): A3PE3000L-FG324I
廠商: Microsemi SoC
文件頁(yè)數(shù): 221/242頁(yè)
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 324-FBGA
標(biāo)準(zhǔn)包裝: 84
系列: ProASIC3EL
RAM 位總計(jì): 516096
輸入/輸出數(shù): 221
門數(shù): 3000000
電源電壓: 1.14V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 324-BGA
供應(yīng)商設(shè)備封裝: 324-FBGA(19x19)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)第195頁(yè)第196頁(yè)第197頁(yè)第198頁(yè)第199頁(yè)第200頁(yè)第201頁(yè)第202頁(yè)第203頁(yè)第204頁(yè)第205頁(yè)第206頁(yè)第207頁(yè)第208頁(yè)第209頁(yè)第210頁(yè)第211頁(yè)第212頁(yè)第213頁(yè)第214頁(yè)第215頁(yè)第216頁(yè)第217頁(yè)第218頁(yè)第219頁(yè)第220頁(yè)當(dāng)前第221頁(yè)第222頁(yè)第223頁(yè)第224頁(yè)第225頁(yè)第226頁(yè)第227頁(yè)第228頁(yè)第229頁(yè)第230頁(yè)第231頁(yè)第232頁(yè)第233頁(yè)第234頁(yè)第235頁(yè)第236頁(yè)第237頁(yè)第238頁(yè)第239頁(yè)第240頁(yè)第241頁(yè)第242頁(yè)
ProASIC3L Device Family Overview
1-2
Revision 13
Flash Advantages
Low Power
The ProASIC3L family of Microsemi flash-based FPGAs provide a low-power advantage, and when
coupled with high performance, enables designers to make power-smart choices using a single-chip,
reprogrammable, and Instant On device.
ProASIC3L devices offer 40% dynamic power and 50% static power savings compared to the equivalent
ProASIC3 device by reducing the core operating voltage to 1.2 V. In addition, the Power Driven Layout
(PDL) feature in Libero System-on-Chip (SoC) offers up to 30% additional power reduction over the
standard timing-driven place-and-route (TDPR). With Flash*Freeze technology, ProASIC3L devices are
able to retain device SRAM and logic while dynamic power is reduced to a minimum, without the need to
stop clock or power supplies. Combining these features provides a low-power, feature-rich and high-
performance solution.
Security
Nonvolatile, flash-based ProASIC3L devices do not require a boot PROM, so there is no vulnerable
external bitstream that can be easily copied. ProASIC3L devices incorporate FlashLock, which provides
a unique combination of reprogrammability and design security without external overhead, advantages
that only an FPGA with nonvolatile flash programming can offer.
ProASIC3L devices utilize a 128-bit flash-based lock and a separate AES key to provide the highest level
of protection in the FPGA industry for programmed intellectual property and configuration data. In
addition, all FlashROM data in ProASIC3L devices can be encrypted prior to loading, using the industry-
leading AES-128 (FIPS192) bit block cipher encryption standard. AES was adopted by the National
Institute of Standards and Technology (NIST) in 2000 and replaces the 1977 DES standard. ProASIC3L
devices have a built-in AES decryption engine and a flash-based AES key that make them the most
comprehensive programmable logic device security solution available today. ProASIC3L devices with
AES-based security provide a high level of protection for remote field updates over public networks such
as the Internet, and are designed to ensure that valuable IP remains out of the hands of system
overbuilders, system cloners, and IP thieves.
Security, built into the FPGA fabric, is an inherent component of the ProASIC3L family. The flash cells
are located beneath seven metal layers, and many device design and layout techniques have been used
to make invasive attacks extremely difficult. The ProASIC3L family, with FlashLock and AES security, is
unique in being highly resistant to both invasive and noninvasive attacks. Your valuable IP is protected
with industry-standard security, making remote ISP possible. A ProASIC3L device provides the best
available security for programmable logic designs.
Single Chip
Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed, the
configuration data is an inherent part of the FPGA structure, and no external configuration data needs to
be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based ProASIC3L FPGAs
do not require system configuration components such as EEPROMs or microcontrollers to load device
configuration data. This reduces bill-of-materials costs and PCB area, and increases security and system
reliability.
Instant On
Flash-based ProASIC3L devices support Level 0 of the Instant On classification standard. This feature
helps in system component initialization, execution of critical tasks before the processor wakes up, setup
and configuration of memory blocks, clock generation, and bus activity management. The Instant On
feature of flash-based ProASIC3L devices greatly simplifies total system design and reduces total
system cost, often eliminating the need for CPLDs and clock generation PLLs. In addition, glitches and
brownouts in system power will not corrupt the ProASIC3L device's flash configuration, and unlike
SRAM-based FPGAs, the device will not have to be reloaded when system power is restored. This
enables the reduction or complete removal of the configuration PROM, expensive voltage monitor,
brownout detection, and clock generator devices from the PCB design. Flash-based ProASIC3L devices
simplify total system design and reduce cost and design risk while increasing system reliability and
improving system initialization time.
相關(guān)PDF資料
PDF描述
A3PE3000L-FGG324I IC FPGA 1KB FLASH 3M 324-FBGA
A1240A-PG132C IC FPGA 4K GATES 132-CPGA COM
EP20K300EFC672-2N IC APEX 20KE FPGA 300K 672-FBGA
EP20K300EFC672-2 IC APEX 20KE FPGA 300K 672-FBGA
APA750-FGG676 IC FPGA PROASIC+ 750K 676-FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A3PE3000L-FG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3EL 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
A3PE3000L-FG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3EL 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
A3PE3000L-FG484M 制造商:Microsemi Corporation 功能描述:FPGA PROASIC3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 341 I/O 484FBGA
A3PE3000L-FG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3EL 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
A3PE3000L-FG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3EL 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)