Revision 13 5-7 v2.0 (continued) Table 3-6 Temperature and Voltage Derating Factors for Timing Delays was updated. 3" />
參數(shù)資料
型號： A3PE600-1FGG256
廠商： Microsemi SoC
文件頁數(shù)： 65/162頁
文件大?。?/td> 0K
描述： IC FPGA 600000 GATES 256-FBGA
標(biāo)準(zhǔn)包裝： 90
系列： ProASIC3E
RAM 位總計： 110592
輸入/輸出數(shù)： 165
門數(shù)： 600000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 256-LBGA
供應(yīng)商設(shè)備封裝： 256-FPBGA（17x17）
ProASIC3E Flash Family FPGAs
Revision 13
5-7
v2.0
(continued)
Table 3-6 Temperature and Voltage Derating Factors for Timing Delays was
updated.
3-5
Table 3-5 Package Thermal Resistivities was updated.
3-5
Table 3-10 Different Components Contributing to the Dynamic Power
Consumption in ProASIC3E Devices was updated.
3-8
tWRO and tCCKH were added to Table 3-94 RAM4K9 and Table
3-95 RAM512X18.
3-74 to
3-74
The note in Table 3-24 I/O Input Rise Time, Fall Time, and Related I/O
Reliability was updated.
3-23
Figure 3-43 Write Access After Write onto Same Address, Figure 3-44 Read
Access After Write onto Same Address, and Figure 3-45 Write Access After
Read onto Same Address are new.
3-71 to 3-
73
Figure 3-53 Timing Diagram was updated.
3-80
Notes were added to the package diagrams identifying if they were top or bottom
view.
N/A
The A3PE1500 "208-Pin PQFP" table is new.
4-4
The A3PE1500 "484-Pin FBGA" table is new.
4-18
The A3PE1500 "A3PE1500 Function" table is new.
4-24
Advance v0.6
(January 2007)
In the "Packaging Tables" table, the number of I/Os for the A3PE1500 was
changed for the FG484 and FG676 packages.
ii
Advance v0.5
(April 2006)
B-LVDS and M-LDVS are new I/O standards added to the datasheet.
N/A
The term flow-through was changed to pass-through.
N/A
Figure 2-8 Very-Long-Line Resources was updated.
2-8
The footnotes in Figure 2-27 CCC/PLL Macro were updated.
2-28
The Delay Increments in the Programmable Delay Blocks specification in Figure
2-24 ProASIC3E CCC Options.
2-24
The "SRAM and FIFO" section was updated.
2-21
The "RESET" section was updated.
2-25
The "WCLK and RCLK" section was updated.
2-25
The "RESET" section was updated.
2-25
The "RESET" section was updated.
2-27
B-LVDS and M-LDVS are new I/O standards added to the datasheet.
N/A
The term flow-through was changed to pass-through.
N/A
Figure 2-8 Very-Long-Line Resources was updated.
2-8
The footnotes in Figure 2-27 CCC/PLL Macro were updated.
2-28
The Delay Increments in the Programmable Delay Blocks specification in Figure
2-24 ProASIC3E CCC Options.
2-24
The "SRAM and FIFO" section was updated.
2-21
The "RESET" section was updated.
2-25
The "WCLK and RCLK" section was updated.
2-25
Revision
Changes
Page
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參數(shù)描述
A3PE600-1FGG256I 功能描述:IC FPGA 600000 GATES 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27）
A3PE600-1FGG484 功能描述:IC FPGA 600000 GATES 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A3PE600-1FGG484I 功能描述:IC FPGA 600000 GATES 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27）
A3PE600-1FGG896 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
A3PE600-1FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
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