2-48 Revision 13 Differential I/O Characteristics Physical Implementation Configuration of the I" />
參數(shù)資料
型號： A3PE600-2FG256
廠商： Microsemi SoC
文件頁數(shù)： 122/162頁
文件大?。?/td> 0K
描述： IC FPGA 600000 GATES 256-FBGA
標(biāo)準(zhǔn)包裝： 90
系列： ProASIC3E
RAM 位總計： 110592
輸入/輸出數(shù)： 165
門數(shù)： 600000
電源電壓： 1.425 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 256-LBGA
供應(yīng)商設(shè)備封裝： 256-FPBGA（17x17）
ProASIC3E DC and Switching Characteristics
2-48
Revision 13
Differential I/O Characteristics
Physical Implementation
Configuration of the I/O modules as a differential pair is handled by the Designer software when the user
instantiates a differential I/O macro in the design.
Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output
Register (OutReg), Enable Register (EnReg), and DDR. However, there is no support for bidirectional
I/Os or tristates with the LVPECL standards.
LVDS
Low-Voltage Differential Signaling (ANSI/TIA/EIA-644) is a high-speed, differential I/O standard. It
requires that one data bit be carried through two signal lines, so two pins are needed. It also requires
external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-22. The
building blocks of the LVDS transmitter-receiver are one transmitter macro, one receiver macro, three
board resistors at the transmitter end, and one resistor at the receiver end. The values for the three driver
resistors are different from those used in the LVPECL implementation because the output standard
specifications are different.
Along with LVDS I/O, ProASIC3E also supports Bus LVDS structure and Multipoint LVDS (M-LVDS)
configuration (up to 40 nodes).
Figure 2-22 LVDS Circuit Diagram and Board-Level Implementation
140
100
Z0 = 50
165
165
+
–
P
N
P
N
INBUF_LVDS
OUTBUF_LVDS
FPGA
Bourns Part Number: CAT16-LV4F12
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