參數(shù)資料
型號(hào): A3PN060-1VQG100I
廠(chǎng)商: Microsemi SoC
文件頁(yè)數(shù): 10/114頁(yè)
文件大?。?/td> 0K
描述: IC FPGA NANO 60K GATES 100-VQFP
標(biāo)準(zhǔn)包裝: 90
系列: ProASIC3 nano
RAM 位總計(jì): 18432
輸入/輸出數(shù): 71
門(mén)數(shù): 60000
電源電壓: 1.425 V ~ 1.575 V
安裝類(lèi)型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 100-TQFP
供應(yīng)商設(shè)備封裝: 100-VQFP(14x14)
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Revision 11
5-1
5 – Datasheet Information
List of Changes
The following table lists critical changes that were made in each revision of the ProASIC3 nano
datasheet.
Revision
Changes
Page
Revision 11
(January 2013)
The "ProASIC3 nano Ordering Information" section has been updated to mention "Y"
as "Blank" mentioning "Device Does Not Include License to Implement IP Based on
the Cryptography Research, Inc. (CRI) Patent Portfolio" (SAR 43219).
Added a Note stating "VMV pins must be connected to the corresponding VCCI pins. See
" to
The programming temperature range supported is Tambient = 0°C to 85°C.
The note in Table 2-73 ProASIC3 nano CCC/PLL Specification referring the reader to
SmartGen was revised to refer instead to the online help associated with the core
(SAR 42570).
Libero Integrated Design Environment (IDE) was changed to Libero System-on-Chip
(SoC) throughout the document (SAR 40288).
Live at Power-Up (LAPU) has been replaced with ’Instant On’.
NA
Revision 10
(September 2012)
The "Security" section was modified to clarify that Microsemi does not support read-
back of programmed data.
Revision 9
(March 2012)
revised to clarify that although no existing security measures can give an absolute
guarantee, Microsemi FPGAs implement the best security available in the industry
(SAR 34668).
Notes indicating that A3P015 is not recommended for new designs have been added
(SAR 36761).
Notes indicating that nano-Z devices are not recommended for use in new designs
(SAR 36702).
The Y security option and Licensed DPA Logo were added to the "ProASIC3 nano
Ordering Information" section. The trademarked Licensed DPA Logo identifies that a
product is covered by a DPA counter-measures license from Cryptography Research
(SAR 34726).
Corrected the Commercial Temperature range to reflect a range of 0°C to 70°C
instead of –20°C to 70°C in the "ProASIC3 nano Ordering Information", "Temperature
(SAR 37097).
The following sentence was removed from the "Advanced Architecture" section: "In
addition, extensive on-chip programming circuitry enables rapid, single-voltage (3.3 V)
programming of IGLOO nano devices via an IEEE 1532 JTAG interface" (SAR 34688).
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A3PN060-2VQ100 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:ProASIC3 nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門(mén)數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
A3PN060-2VQ100I 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:ProASIC3 nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門(mén)數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
A3PN060-2VQG100 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:ProASIC3 nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門(mén)數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
A3PN060-2VQG100I 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:ProASIC3 nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門(mén)數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
A3PN060-DIELOT 制造商:Microsemi Corporation 功能描述:A3PN060-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film