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參數(shù)資料
| 型號： | A3PN250-2VQ100 |
| 廠商： | Microsemi SoC |
| 文件頁數(shù)： | 14/114頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA NANO 250K GATES 100-VQFP |
| 標準包裝： | 90 |
| 系列： | ProASIC3 nano |
| RAM 位總計： | 36864 |
| 輸入/輸出數(shù)： | 68 |
| 門數(shù)： | 250000 |
| 電源電壓： | 1.425 V ~ 1.575 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 100-TQFP |
| 供應(yīng)商設(shè)備封裝： | 100-VQFP（14x14） |
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Datasheet Information
5-4
Revision 11
Revision
Changes
Page
Revision 7 (Jan 2010)
Product Brief Advance
v0.7
All product tables and pin tables were updated to show clearly that A3PN030 is
available only in the Z feature at this time, as A3PN030Z. The nano-Z feature
grade devices are designated with a Z at the end of the part number.
N/A
Packaging Advance
v0.6
The "68-Pin QFN" and "100-Pin VQFP" pin tables for A3PN030 were removed.
Only the Z grade for A3PN030 is available at this time.
N/A
Revision 6 (Aug 2009)
Product Brief Advance
v0.6
Packaging
Advance
v0.5
The note for A3PN030 in the "ProASIC3 nano Devices" table was revised. It
states A3PN030 is available in the Z feature grade only.
The "68-Pin QFN" pin table for A3PN030 is new.
3-7
are new.
The "100-Pin VQFP" pin table for A3PN060Z is new.
The "100-Pin VQFP" pin table for A3PN125Z is new
The "100-Pin VQFP" pin table for A3PN250Z is new.
Revision 5 (Mar 2009)
Product Brief Advance
v0.5
All references to speed grade –F were removed from this document.
N/A
The"I/Os with Advanced I/O Standards" section was revised to add definitions of
hot-swap and cold-sparing.
Revision 4 (Feb 2009)
Packaging Advance
v0.4
The "100-Pin VQFP" pin table for A3PN030 is new.
3-10
Revision 3 (Feb 2009)
Packaging Advance
v0.3
The "100-Pin QFN" section was removed.
N/A
Revision 2 (Nov 2008)
Product Brief Advance
v0.4
The "ProASIC3 nano Devices" table was revised to change the maximum user
I/Os for A3PN020 and A3PN030. The following table note was removed: "Six chip
(main) and three quadrant global networks are available for A3PN060 and
above."
The QN100 package was removed for all devices.
N/A
The "Device Marking" section is new.
Revision 1 (Oct 2008)
Product Brief Advance
v0.3
The A3PN030 device was added to product tables and replaces A3P030 entries
that were formerly in the tables.
The "Wide Range I/O Support" section is new.
The "I/Os Per Package" table was updated to add the following information to
table note 4: "For nano devices, the VQ100 package is offered in both leaded and
RoHS-compliant versions. All other packages are RoHS-compliant only."
updated to remove QN100 for A3PN250.
The "General Description" section was updated to give correct information about
number of gates and dual-port RAM for ProASIC3 nano devices.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A3PN250-2VQ100I | 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| A3PN250-2VQG100 | 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| A3PN250-2VQG100I | 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| A3PN250-DIELOT | 制造商:Microsemi Corporation 功能描述:A3PN250-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film |
| A3PN250-VQ100 | 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASIC3 nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
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