參數(shù)資料
型號: A40MX02-3PL44I
廠商: Microsemi SoC
文件頁數(shù): 45/142頁
文件大小: 0K
描述: IC FPGA MX SGL CHIP 3K 44-PLCC
標(biāo)準(zhǔn)包裝: 27
系列: MX
輸入/輸出數(shù): 34
門數(shù): 3000
電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 44-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 44-PLCC(16.59x16.59)
Re vi s i on 11
3-1
3 – Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Revision
Changes
Page
Revision 11
(May 2012)
The FuseLock logo and accompanying text was removed from the "User Security"
section. This marking is no longer used on Microsemi devices (PCN 0915).
The "Development Tool Support" section was updated (SAR 38512).
Revision 10
(April 2012)
"Ordering Information" was updated to include lead-free package ordering codes
(SAR 21968).
The "User Security" section was revised to clarify that although no existing security
measures can give an absolute guarantee, Microsemi FPGAs implement the best
security available in the industry (SAR 34673).
The "Transient Current" section is new (SAR 36930).
Package names were revised according to standards established in Package
Revision 9
(v6.1, April 2009)
In Table 1-14 Absolute Maximum Ratings*, the limits in VI were changed from -0.5 to
VCCI + 0.5 to -0.5 to VCCA + 0.5.
to 2.4 for the min in industrial and military. VIH had VCCI and that was changed to
VCCA.
v6.0
(January 2004)
The "User Security" section was updated.
相關(guān)PDF資料
PDF描述
ABM43DTBD-S189 CONN EDGECARD 86POS R/A .156 SLD
ABM43DTAN-S189 CONN EDGECARD 86POS R/A .156 SLD
EP4CE30F29C7 IC CYCLONE IV FPGA 30K 780FBGA
APA150-TQG100A IC FPGA PROASIC+ 150K 100-TQFP
ABM43DTAH-S189 CONN EDGECARD 86POS R/A .156 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A40MX02-3PL44M 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
A40MX02-3PL68 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A40MX02-3PL68I 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A40MX02-3PL68M 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
A40MX02-3PLG44 功能描述:IC FPGA MX SGL CHIP 3K 44-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)