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參數資料
型號: A40MX02-3VQ80I
廠商: Microsemi SoC
文件頁數: 95/142頁
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 3K 80-VQFP
標準包裝: 90
系列: MX
輸入/輸出數: 57
門數: 3000
電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 80-TQFP
供應商設備封裝: 80-VQFP(14x14)
40MX and 42MX FPGA Families
1- 52
R e v i sio n 1 1
Table 1-32 A42MX09 Timing Characteristics (Nominal 5.0 V Operation)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Units
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
Logic Module Propagation Delays1
tPD1
Single Module
1.2
1.3
1.5
1.8
2.5
ns
tCO
Sequential Clock-to-Q
1.3
1.4
1.6
1.9
2.7
ns
tGO
Latch G-to-Q
1.2
1.4
1.6
1.8
2.6
ns
tRS
Flip-Flop (Latch) Reset-to-Q
1.2
1.6
1.8
2.1
2.9
ns
Logic Module Predicted Routing Delays2
tRD1
FO = 1 Routing Delay
0.7
0.8
0.9
1.0
1.4
ns
tRD2
FO = 2 Routing Delay
0.9
1.0
1.2
1.4
1.9
ns
tRD3
FO = 3 Routing Delay
1.2
1.3
1.5
1.7
2.4
ns
tRD4
FO = 4 Routing Delay
1.4
1.5
1.7
2.0
2.9
ns
tRD8
FO = 8 Routing Delay
2.3
2.6
2.9
3.4
4.8
ns
Logic Module Sequential Timing3, 4
tSUD
Flip-Flop (Latch)
Data Input Set-Up
0.3
0.4
0.5
0.7
ns
tHD
Flip-Flop (Latch) Data Input Hold
0.0
ns
tSUENA
Flip-Flop (Latch) Enable Set-Up
0.4
0.5
0.6
0.8
ns
tHENA
Flip-Flop (Latch) Enable Hold
0.0
ns
tWCLKA
Flip-Flop (Latch) Clock Active
Pulse Width
3.4
3.8
4.3
5.0
7.0
ns
tWASYN
Flip-Flop (Latch) Asynchronous
Pulse Width
4.5
4.9
5.6
6.6
9.2
ns
tA
Flip-Flop Clock Input Period
3.5
3.8
4.3
5.1
7.1
ns
tINH
Input Buffer Latch Hold
0.0
ns
tINSU
Input Buffer Latch Set-Up
0.3
0.4
0.6
ns
tOUTH
Output Buffer Latch Hold
0.0
ns
tOUTSU
Output Buffer Latch Set-Up
0.3
0.4
0.6
ns
fMAX
Flip-Flop (Latch) Clock Frequency
268
244
224
195
117
MHz
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External
setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external
PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
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