Junction Temperature (TJ) The" />
參數(shù)資料
型號: A40MX04-1PL44I
廠商: Microsemi SoC
文件頁數(shù): 65/142頁
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 6K 44-PLCC
標(biāo)準(zhǔn)包裝: 27
系列: MX
輸入/輸出數(shù): 34
門數(shù): 6000
電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 44-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 44-PLCC(16.59x16.59)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 25
Junction Temperature (TJ)
The temperature variable in the Designer software refers to the junction temperature, not the ambient
temperature. This is an important distinction because the heat generated from dynamic power
consumption is usually hotter than the ambient temperature. EQ , shown below, can be used to calculate
junction temperature.
Junction Temperature =
ΔT + T
a (1)
EQ 1
Where:
Ta = Ambient Temperature
ΔT = Temperature gradient between junction (silicon) and ambient
ΔT = θ
ja * P (2)
P = Power
θ
ja = Junction to ambient of package. θja numbers are located in Table 1-21 on page 1-26.
Figure 1-15 Typical Output Drive Characteristics (Based Upon Measured Data)
0
1
23
45
6
MX PCI IOL
MX PCI IOH
PCI IOL Maximum
PCI IOL Minimum
PCI IOH Minimum
PCI IOH Maximum
Voltage Out (V)
–0.20
–0.15
–0.10
–0.05
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
Current
(A)
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