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| 型號： | A40MX04-1PL84I |
| 元件分類： | FPGA |
| 英文描述： | FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQCC84 |
| 封裝： | PLASTIC, LCC-84 |
| 文件頁數(shù)： | 34/124頁 |
| 文件大?。?/td> | 3142K |
| 代理商： | A40MX04-1PL84I |
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40MX and 42MX FPGA Families
v6.1
1-11
Each I/O cell has three boundary-scan register cells, each
with a serial-in, serial-out, parallel-in, and parallel-out
pin. The serial pins are used to serially connect all the
boundary-scan register cells in a device into a boundary-
scan register chain, which starts at the TDI pin and ends
at the TDO pin. The parallel ports are connected to the
internal core logic tile and the input, output and control
ports of an I/O buffer to capture and load data into the
register to control or observe the logic state of each I/O.
Figure 1-14 42MX IEEE 1149.1 Boundary Scan Circuitry
Table 3
Test Access Port Descriptions
Port
Description
TMS
(Test
Mode
Select)
Serial input for the test logic control bits. Data is captured on the rising edge of the test logic clock (TCK).
TCK (Test Clock Input) Dedicated test logic clock used serially to shift test instruction, test data, and control inputs on the rising edge
of the clock, and serially to shift the output data on the falling edge of the clock. The maximum clock frequency
for TCK is 20 MHz.
TDI (Test Data Input)
Serial input for instruction and test data. Data is captured on the rising edge of the test logic clock.
TDO
(Test
Data
Output)
Serial output for test instruction and data from the test logic. TDO is set to an Inactive Drive state (high
impedance) when data scanning is not in progress.
Table 4
Supported BST Public Instructions
Instruction
IR Code (IR2.IR0)
Instruction Type
Description
EXTEST
000
Mandatory
Allows the external circuitry and board-level interconnections to
be tested by forcing a test pattern at the output pins and
capturing test results at the input pins.
SAMPLE/PRELOAD
001
Mandatory
Allows a snapshot of the signals at the device pins to be
captured and examined during operation
HIGH Z
101
Optional
Tristates all I/Os to allow external signals to drive pins. Please
refer to the IEEE Standard 1149.1 specification.
CLAMP
110
Optional
Allows state of signals driven from component pins to be
determined from the Boundary-Scan Register. Please refer to
the IEEE Standard 1149.1 specification for details.
BYPASS
111
Mandatory
Enables the bypass register between the TDI and TDO pins. The
test data passes through the selected device to adjacent devices
in the test chain.
Boundary Scan Register
Instruction
Decode
Control Logic
TAP Controller
Instruction
Register
Bypass
Register
TMS
TCK
TDI
Output
MUX
TDO
JTAG
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A40MX04-1PL84M | 制造商:Microsemi Corporation 功能描述:FPGA 40MX Family 6K Gates 547 Cells 96MHz/160MHz 0.45um Technology 3.3V/5V 84-Pin PLCC 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 84PLCC - Rail/Tube 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 6K 84-PLCC 制造商:Microsemi Corporation 功能描述:IC FPGA 69 I/O 84PLCC |
| A40MX04-1PLG44 | 功能描述:IC FPGA MX SGL CHIP 6K 44-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17） |
| A40MX04-1PLG44I | 功能描述:IC FPGA MX SGL CHIP 6K 44-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17） |
| A40MX04-1PLG44M | 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 44PLCC - Rail/Tube 制造商:Microsemi Corporation 功能描述:IC FPGA 34 I/O 44PLCC 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 6K 44-PLCC |
| A40MX04-1PLG68 | 功能描述:IC FPGA MX SGL CHIP 6K 68-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17） |
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