Input Module Predicted Routing Delays2
參數(shù)資料
型號(hào): A40MX04-VQG80I
廠商: Microsemi SoC
文件頁(yè)數(shù): 117/142頁(yè)
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 6K 80-VQFP
標(biāo)準(zhǔn)包裝: 90
系列: MX
輸入/輸出數(shù): 69
門(mén)數(shù): 6000
電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 80-TQFP
供應(yīng)商設(shè)備封裝: 80-VQFP(14x14)
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40MX and 42MX FPGA Families
1- 72
R e v i sio n 1 1
Input Module Predicted Routing Delays2
tIRD1
FO = 1 Routing Delay
2.6
2.9
3.2
3.8
5.3
ns
tIRD2
FO = 2 Routing Delay
2.9
3.2
3.6
4.3
6.0
ns
tIRD3
FO = 3 Routing Delay
3.2
3.6
4.0
4.8
6.6
ns
tIRD4
FO = 4 Routing Delay
3.5
3.9
4.4
5.2
7.3
ns
tIRD8
FO = 8 Routing Delay
4.8
5.3
6.1
7.1
10.0
ns
Global Clock Network
tCKH
Input LOW to HIGH
FO = 32
FO = 486
4.4
4.8
5.3
5.5
6.0
6.5
7.1
9.1
10.0
ns
tCKL
Input HIGH to LOW
FO = 32
FO = 486
5.1
6.0
5.7
6.6
6.4
7.5
7.6
8.8
10.6
12.4
ns
tPWH
Minimum Pulse
Width HIGH
FO = 32
FO = 486
3.0
3.3
3.7
3.8
4.2
4.5
4.9
6.3
6.9
ns
tPWL
Minimum Pulse
Width LOW
FO = 32
FO = 486
3.0
3.3
3.4
3.7
3.8
4.2
4.5
4.9
6.3
6.9
ns
tCKSW
Maximum Skew
FO = 32
FO = 486
0.8
1.0
1.1
1.6
ns
tSUEXT
Input
Latch
External
Set-Up
FO = 32
FO = 486
0.0
ns
TTL Output Module Timing5
tDLH
Data-to-Pad HIGH
3.4
3.8
4.3
5.0
7.1
ns
tDHL
Data-to-Pad LOW
4.0
4.4
5.0
5.9
8.3
ns
tENZH
Enable Pad Z to HIGH
3.6
4.0
4.5
5.3
7.4
ns
tENZL
Enable Pad Z to LOW
3.9
4.4
5.0
5.8
8.2
ns
tENHZ
Enable Pad HIGH to Z
7.2
8.0
9.1
10.7
14.9
ns
tENLZ
Enable Pad LOW to Z
6.7
7.5
8.5
9.9
13.9
ns
tGLH
G-to-Pad HIGH
4.8
5.3
6.0
7.2
10.0
ns
tGHL
G-to-Pad LOW
4.8
5.3
6.0
7.2
10.0
ns
tLSU
I/O Latch Output Set-Up
0.7
0.8
1.0
1.4
ns
Table 1-37 A42MX24 Timing Characteristics (Nominal 3.3 V Operation) (continued)
(Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed –F Speed
Units
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
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