<li id="w2tdz"><tr id="w2tdz"><sup id="w2tdz"></sup></tr></li>
<dfn id="w2tdz"><label id="w2tdz"><legend id="w2tdz"></legend></label></dfn>
  • <dfn id="w2tdz"><tbody id="w2tdz"><dfn id="w2tdz"></dfn></tbody></dfn><span id="w2tdz"><pre id="w2tdz"><strong id="w2tdz"></strong></pre></span><dfn id="w2tdz"><thead id="w2tdz"></thead></dfn>
  • <dfn id="w2tdz"><tbody id="w2tdz"><dfn id="w2tdz"></dfn></tbody></dfn>
    參數(shù)資料
    型號(hào): A42MX09-2VQG100
    廠商: Microsemi SoC
    文件頁(yè)數(shù): 53/142頁(yè)
    文件大?。?/td> 0K
    描述: IC FPGA MX SGL CHIP 14K 100VQFP
    標(biāo)準(zhǔn)包裝: 90
    系列: MX
    輸入/輸出數(shù): 83
    門數(shù): 14000
    電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
    安裝類型: 表面貼裝
    工作溫度: 0°C ~ 70°C
    封裝/外殼: 100-TQFP
    供應(yīng)商設(shè)備封裝: 100-VQFP(14x14)
    第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)當(dāng)前第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)
    40MX and 42MX FPGA Families
    1- 14
    R e v i sio n 1 1
    parallel ports are connected to the internal core logic tile and the input, output and control ports of an I/O
    buffer to capture and load data into the register to control or observe the logic state of each I/O.
    Figure 1-13 42MX IEEE 1149.1 Boundary Scan Circuitry
    Table 1-3
    Test Access Port Descriptions
    Port
    Description
    TMS
    (Test Mode Select)
    Serial input for the test logic control bits. Data is captured on the rising edge of the test logic
    clock (TCK).
    TCK
    (Test Clock Input)
    Dedicated test logic clock used serially to shift test instruction, test data, and control inputs
    on the rising edge of the clock, and serially to shift the output data on the falling edge of the
    clock. The maximum clock frequency for TCK is 20 MHz.
    TDI
    (Test Data Input)
    Serial input for instruction and test data. Data is captured on the rising edge of the test logic
    clock.
    TDO
    (Test Data Output)
    Serial output for test instruction and data from the test logic. TDO is set to an Inactive Drive
    state (high impedance) when data scanning is not in progress.
    Table 1-4
    Supported BST Public Instructions
    Instruction
    IR Code
    (IR2.IR0)
    Instruction
    Type
    Description
    EXTEST
    000
    Mandatory
    Allows the external circuitry and board-level interconnections to be
    tested by forcing a test pattern at the output pins and capturing test
    results at the input pins.
    SAMPLE/PRELOAD
    001
    Mandatory
    Allows a snapshot of the signals at the device pins to be captured
    and examined during operation
    HIGH Z
    101
    Optional
    Tristates all I/Os to allow external signals to drive pins. Please refer to
    the IEEE Standard 1149.1 specification.
    CLAMP
    110
    Optional
    Allows state of signals driven from component pins to be determined
    from the Boundary-Scan Register. Please refer to the IEEE Standard
    1149.1 specification for details.
    BYPASS
    111
    Mandatory
    Enables the bypass register between the TDI and TDO pins. The test
    data passes through the selected device to adjacent devices in the
    test chain.
    Boundary Scan Register
    Instruction
    Decode
    Control Logic
    TAP Controller
    Instruction
    Register
    Bypass
    Register
    TMS
    TCK
    TDI
    Output
    MUX
    TDO
    JTAG
    相關(guān)PDF資料
    PDF描述
    A42MX09-1PL84I IC FPGA MX SGL CHIP 14K 84-PLCC
    A42MX09-1PLG84I IC FPGA MX SGL CHIP 14K 84-PLCC
    A42MX16-VQ100 IC FPGA MX SGL CHIP 24K 100-VQFP
    M1AFS250-2QNG180I IC FPGA 2MB FLASH 250K 180-QFN
    AFS250-2QNG180I IC FPGA 2MB FLASH 250K 180-QFN
    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    A42MX09-2VQG100I 功能描述:IC FPGA MX SGL CHIP 14K 100VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
    A42MX09-3BG100 制造商:未知廠家 制造商全稱:未知廠家 功能描述:40MX and 42MX FPGA Families
    A42MX09-3BG100A 制造商:未知廠家 制造商全稱:未知廠家 功能描述:40MX and 42MX FPGA Families
    A42MX09-3BG100B 制造商:未知廠家 制造商全稱:未知廠家 功能描述:40MX and 42MX FPGA Families
    A42MX09-3BG100ES 制造商:未知廠家 制造商全稱:未知廠家 功能描述:40MX and 42MX FPGA Families