(Worst-Case " />
參數(shù)資料
型號(hào): A42MX09-PLG84
廠商: Microsemi SoC
文件頁數(shù): 89/142頁
文件大?。?/td> 0K
描述: IC FPGA 104I/O 84PLCC
標(biāo)準(zhǔn)包裝: 16
系列: MX
輸入/輸出數(shù): 72
門數(shù): 14000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 84-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 84-PLCC(29.31x29.31)
其它名稱: 1100-1049
40MX and 42MX FPGA Families
1- 46
R e v i sio n 1 1
Table 1-30 A40MX04 Timing Characteristics (Nominal 5.0 V Operation)
(Worst-Case Commercial Conditions, VCC = 4.75 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Units
Parameter / Description
Min. Max.
Min.
Max. Min. Max. Min. Max. Min. Max.
Logic Module Propagation Delays
tPD1
Single Module
1.2
1.4
1.6
1.9
2.7
ns
tPD2
Dual-Module Macros
2.3
3.1
3.5
4.1
5.7
ns
tCO
Sequential Clock-to-Q
1.2
1.4
1.6
1.9
2.7
ns
tGO
Latch G-to-Q
1.2
1.4
1.6
1.9
2.7
ns
tRS
Flip-Flop (Latch) Reset-to-Q
1.2
1.4
1.6
1.9
2.7
ns
Logic Module Predicted Routing Delays1
tRD1
FO = 1 Routing Delay
1.2
1.6
1.8
2.1
3.0
ns
tRD2
FO = 2 Routing Delay
1.9
2.2
2.5
2.9
4.1
ns
tRD3
FO = 3 Routing Delay
2.4
2.8
3.2
3.7
5.2
ns
tRD4
FO = 4 Routing Delay
2.9
3.4
3.9
4.5
6.3
ns
tRD8
FO = 8 Routing Delay
5.0
5.8
6.6
7.8
10.9
ns
Logic Module Sequential Timing2
tSUD
Flip-Flop (Latch)
Data Input Set-Up
3.1
3.5
4.0
4.7
6.6
ns
tHD
3
Flip-Flop (Latch)
Data Input Hold
0.0
ns
tSUENA
Flip-Flop (Latch)
Enable Set-Up
3.1
3.5
4.0
4.7
6.6
ns
tHENA
Flip-Flop (Latch)
Enable Hold
0.0
ns
tWCLKA
Flip-Flop (Latch)
Clock Active Pulse Width
3.3
3.8
4.3
5.0
7.0
ns
tWASYN Flip-Flop (Latch)
Asynchronous Pulse Width
3.3
3.8
4.3
5.0
7.0
ns
tA
Flip-Flop Clock Input Period
4.8
5.6
6.3
7.5
10.4
ns
fMAX
Flip-Flop (Latch)
Clock Frequency
(FO = 128)
181
167
154
134
80
MHz
Input Module Propagation Delays
tINYH
Pad-to-Y HIGH
0.7
0.8
0.9
1.1
1.5
ns
tINYL
Pad-to-Y LOW
0.6
0.7
0.8
1.0
1.3
ns
Notes:
1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.
3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Timer utility from the Designer software to
check the hold time for this macro.
4. Delays based on 35 pF loading.
相關(guān)PDF資料
PDF描述
M1AGL600V2-CSG281 IC FPGA 1KB FLASH 600K 281-CSP
RSC50DRYH-S93 CONN EDGECARD 100PS DIP .100 SLD
RMC50DRYH-S93 CONN EDGECARD 100PS DIP .100 SLD
RSC65DREI-S93 CONN EDGECARD 130POS .100 EYELET
RMC65DREI-S93 CONN EDGECARD 130PS .100 EYELET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A42MX09-PLG84A 功能描述:IC FPGA MX SGL CHIP 14K 84-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A42MX09-PLG84I 功能描述:IC FPGA MX SGL CHIP 14K 84-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A42MX09-PLG84M 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 84PLCC - Rail/Tube 制造商:Microsemi Corporation 功能描述:IC FPGA 72 I/O 84PLCC
A42MX09-PQ100 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
A42MX09-PQ100A 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)