參數(shù)資料
型號(hào)： A42MX09-VQ100MX79
元件分類： FPGA
英文描述： FPGA, 336 CLBS, 14000 GATES, 117 MHz, PQFP100
封裝： 1 MM HEIGHT, PLASTIC, VQFP-100
文件頁數(shù)： 46/124頁
文件大?。?/td> 3142K
代理商： A42MX09-VQ100MX79
40MX and 42MX FPGA Families
1- 22
v6.1
Junction Temperature (TJ)
The temperature variable in the Designer software refers
to
the
junction
temperature,
not
the
ambient
temperature. This is an important distinction because the
heat generated from dynamic power consumption is
usually hotter than the ambient temperature. EQ 1-1,
shown below, can be used to calculate junction
temperature.
EQ 1-1
Junction Temperature =
ΔT + T
a(1)
Where:
Ta = Ambient Temperature
ΔT = Temperature gradient between junction (silicon)
and ambient
ΔT = θ
ja * P(2)
P = Power
θ
ja = Junction to ambient of package. θja numbers are
located in the Package Thermal Characteristics table
below.
Package Thermal Characteristics
The device junction-to-case thermal characteristic is
θ
jc,
and the junction-to-ambient air characteristic is
θ
ja. The
thermal characteristics for
θ
ja are shown with two
different air flow rates.
The maximum junction temperature is 150
°C.
Maximum
power
dissipation
for
commercial-
and
industrial-grade devices is a function of θja.
A sample calculation of the absolute maximum power
dissipation allowed for a TQFP 176-pin package at
commercial temperature and still air is as follow:
The maximum power dissipation for military-grade devices is a function of θjc. A sample calculation of the absolute
maximum power dissipation allowed for CQFP 208-pin package at military temperature and still air is as follows:
Table 21
Package Thermal Characteristics
Plastic Packages
Pin Count
θ
jc
θ
ja
Units
Still Air
1.0 m/s
200 ft/min.
2.5 m/s
500 ft/min.
Plastic Quad Flat Pack
100
12.0
27.8
23.4
21.2
°C/W
Plastic Quad Flat Pack
160
10.0
26.2
22.8
21.1
°C/W
Plastic Quad Flat Pack
208
8.0
26.1
22.5
20.8
°C/W
Plastic Quad Flat Pack
240
8.5
25.6
22.3
20.8
°C/W
Plastic Leaded Chip Carrier
44
16.0
20.0
24.5
22.0
°C/W
Plastic Leaded Chip Carrier
68
13.0
25.0
21.0
19.4
°C/W
Plastic Leaded Chip Carrier
84
12.0
22.5
18.9
17.6
°C/W
Thin Plastic Quad Flat Pack
176
11.0
24.7
19.9
18.0
°C/W
Very Thin Plastic Quad Flat Pack
80
12.0
38.2
31.9
29.4
°C/W
Very Thin Plastic Quad Flat Pack
100
10.0
35.3
29.4
27.1
°C/W
Plastic Ball Grid Array
272
3.0
18.3
14.9
13.9
°C/W
Ceramic Packages
Ceramic Quad Flat Pack
208
2.0
22.0
19.8
18.0
°C/W
Ceramic Quad Flat Pack
256
2.0
20.0
16.5
15.0
°C/W
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
–
θ
ja(°C/W)
---------------------------------------------------------------------------------------------------------------------------------
150
°C70°C
–
28
°C/W
-----------------------------------
2.86W
=
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
–
θ
jc(°C/W)
---------------------------------------------------------------------------------------------------------------------------------
150
°C 125°C
–
6.3
°C/W
--------------------------------------
3.97W
=
相關(guān)PDF資料
PDF描述
A42MX09-VQ100M FPGA, 336 CLBS, 14000 GATES, 117 MHz, PQFP100
A42MX09-VQ100X79 FPGA, 336 CLBS, 14000 GATES, 117 MHz, PQFP100
A42MX09-VQ100 FPGA, 336 CLBS, 14000 GATES, 117 MHz, PQFP100
AFS250-FFG256 FPGA, 250000 GATES, PBGA256
AFS250-FFGG256 FPGA, 250000 GATES, PBGA256
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A42MX09-VQ208A 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:40MX and 42MX Automotive FPGA Families
A42MX09-VQG100 功能描述:IC FPGA 104I/O 100VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計(jì):226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP（28x28）
A42MX09-VQG100A 功能描述:IC FPGA MX SGL CHIP 14K 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A42MX09-VQG100I 功能描述:IC FPGA MX SGL CHIP 14K 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:MX 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A42MX09-VQG100M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 14K Gates 336 Cells 129MHz/215MHz 0.45um Technology 3.3V/5V 100-Pin VQFP 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 14K Gates 336 Cells 129MHz/215MHz 0.45um (CMOS) Technology 3.3V/5V 100-Pin VQFP 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 100VQF - Trays 制造商:Microsemi SOC Products Group 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 100VQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 100-VQFP
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