CMOS Output Module Timing5 t" />
參數(shù)資料
型號: A42MX16-PQ160
廠商: Microsemi SoC
文件頁數(shù): 107/142頁
文件大小: 0K
描述: IC FPGA MX SGL CHIP 24K 160-PQFP
標準包裝: 24
系列: MX
輸入/輸出數(shù): 125
門數(shù): 24000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 160-BQFP
供應商設備封裝: 160-PQFP(28x28)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 63
CMOS Output Module Timing5
tDLH
Data-to-Pad HIGH
3.2
3.6
4.0
4.7
6.6
ns
tDHL
Data-to-Pad LOW
2.5
2.7
3.1
3.6
5.1
ns
tENZH
Enable Pad Z to HIGH
2.7
3.4
4.0
5.6
ns
tENZL
Enable Pad Z to LOW
3.0
3.3
3.8
4.4
6.2
ns
tENHZ
Enable Pad HIGH to Z
5.4
6.0
6.8
8.0
11.2
ns
tENLZ
Enable Pad LOW to Z
5.0
5.6
6.3
7.4
10.4
ns
tGLH
G-to-Pad HIGH
5.1
5.6
6.4
7.5
10.5
ns
tGHL
G-to-Pad LOW
5.1
5.6
6.4
7.5
10.5
ns
tLCO
I/O Latch Clock-to-Out
(Pad-to-Pad), 64 Clock Loading
5.7
6.3
7.1
8.4
11.9
ns
tACO
Array Clock-to-Out
(Pad-to-Pad), 64 Clock Loading
8.0
8.9
10.1
11.9
16.7
ns
dTLH
Capacitive Loading, LOW to HIGH
0.03
0.04
0.06 ns/pF
Table 1-34 A42MX16 Timing Characteristics (Nominal 5.0 V Operation) (continued)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Units
Parameter / Description
Min. Max. Min. Max.
Min. Max. Min. Max. Min. Max.
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, point and position whichever is
appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External
setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external
PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
相關PDF資料
PDF描述
AFS090-2FGG256I IC FPGA 2MB FLASH 90K 256FBGA
AFS090-2FG256I IC FPGA 2MB FLASH 90K 256FBGA
A42MX09-PQG160A IC FPGA MX SGL CHIP 14K 160-PQFP
A42MX09-PQ160A IC FPGA MX SGL CHIP 14K 160-PQFP
A54SX16P-VQG100 IC FPGA SX 24K GATES 100-VQFP
相關代理商/技術參數(shù)
參數(shù)描述
A42MX16-PQ160A 功能描述:IC FPGA MX SGL CHIP 24K 160-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A42MX16-PQ160I 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 24K Gates 608 Cells 103MHz/172MHz 0.45um Technology 3.3V/5V 160-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA 24K GATES 608 CELLS 103MHZ/172MHZ IND 0.45UM 3.3V/5V 16 - Trays 制造商:Microsemi Corporation 功能描述:24K GATES 608 CELLS 103MHZ/172MHZ 0.45UM
A42MX16-PQ160M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 24K Gates 608 Cells 103MHz/172MHz 0.45um Technology 3.3V/5V 160-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA 24K GATES 608 CELLS 103MHZ/172MHZ 0.45UM 3.3V/5V 160PQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 125 I/O 160PQFP 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 24K 160-PQFP
A42MX16-PQ208 功能描述:IC FPGA MX SGL CHIP 24K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A42MX16-PQ208A 功能描述:IC FPGA MX SGL CHIP 24K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)