tINYH Pad-to-Y HIGH " />
參數(shù)資料
型號: A42MX36-BGG272
廠商: Microsemi SoC
文件頁數(shù): 109/142頁
文件大?。?/td> 0K
描述: IC FPGA MX SGL CHIP 54K 272-PBGA
標準包裝: 40
系列: MX
RAM 位總計: 2560
輸入/輸出數(shù): 202
門數(shù): 54000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 272-BBGA
供應商設備封裝: 272-PBGA(27x27)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 65
Input Module Propagation Delays
tINYH
Pad-to-Y HIGH
1.5
1.6
1.9
2.2
3.1
ns
tINYL
Pad-to-Y LOW
1.1
1.3
1.4
1.7
2.4
ns
tINGH
G to Y HIGH
2.0
2.2
2.5
2.9
4.1
ns
tINGL
G to Y LOW
2.0
2.2
2.5
2.9
4.1
ns
Input Module Predicted Routing Delays2
tIRD1
FO = 1 Routing Delay
2.6
2.9
3.2
3.8
5.3
ns
tIRD2
FO = 2 Routing Delay
2.9
3.2
3.7
4.3
6.1
ns
tIRD3
FO = 3 Routing Delay
3.3
3.6
4.1
4.9
6.8
ns
tIRD4
FO = 4 Routing Delay
3.6
4.0
4.6
5.4
7.6
ns
tIRD8
FO = 8 Routing Delay
5.1
5.6
6.4
7.5
10.5
ns
Global Clock Network
tCKH
Input LOW to HIGH
FO = 32
FO = 384
4.4
4.8
5.3
5.5
6.0
6.5
7.1
9.0
9.9
ns
tCKL
Input HIGH to LOW
FO = 32
FO = 384
5.3
6.2
5.9
6.9
6.7
7.9
7.8
9.2
11.0
12.9
ns
tPWH
Minimum Pulse
Width HIGH
FO = 32
FO = 384
5.7
6.6
6.3
7.4
7.1
8.3
8.4
9.8
11.8
13.7
ns
tPWL
Minimum Pulse
Width LOW
FO = 32
FO = 384
5.3
6.2
5.9
6.9
6.7
7.9
7.8
9.2
11.0
12.9
ns
tCKSW
Maximum Skew
FO = 32
FO = 384
0.5
2.2
0.5
2.4
0.6
2.7
0.7
3.2
1.0
4.5
ns
tSUEXT
Input Latch External
Set-Up
FO = 32
FO = 384
0.0
ns
tHEXT
Input Latch External
Hold
FO = 32
FO = 384
3.9
4.5
4.3
4.9
5.6
5.7
6.6
8.0
9.2
ns
tP
Minimum Period
FO = 32
FO = 384
7.0
7.7
7.8
8.6
8.4
9.3
9.7
10.7
16.2
17.8
ns
fMAX
Maximum Frequency FO = 32
FO = 384
142
129
117
119
108
103
94
62
56
MHz
Table 1-35 A42MX16 Timing Characteristics (Nominal 3.3 V Operation) (continued)
(Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units
Notes:
1. For dual-module macros use tPD1 + tRD1 + taped, to + tRD1 + taped, or tPD1 + tRD1 + tusk, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External
setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external
PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
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