參數(shù)資料
型號： A42MX36-FPQ100B
廠商： Electronic Theatre Controls, Inc.
英文描述： 40MX and 42MX FPGA Families
中文描述： 40MX和42MX FPGA系列
文件頁數(shù)： 2/123頁
文件大小： 854K
代理商： A42MX36-FPQ100B
40MX and 42MX FPGA Families
ii
v6.0
Ordering Information
Plastic Device Resources
_
Part Number
A40MX02
A40MX04
A42MX09
A42MX16
A42MX24
A42MX36
Speed Grade
Blank = Standard Speed
–1 =
Approximately 15% Faster than Standard
–2 =
Approximately 25% Faster than Standard
–3 =
Approximately 35% Faster than Standard
–F
=
Approximately 40% Slower than Standard
Package Type
PL =
PQ =
TQ =
VQ =
BG =
CQ =
Package Lead Count
Blank = Commercial (0 to +70C)
I
= Industrial (–40 to +85C)
M
= Military (–55 to +125C)
B
= MIL-STD-883
A
= Automotive (–40 to +125C)
Application (Temperature Range)
Plastic Leaded Chip Carrier
Plastic Quad Flat Pack
Thin (1.4 mm) Quad Flat Pack
Very Thin (1.0 mm) Quad Flat Pack
Plastic Ball Grid Array
Ceramic Quad Flat Pack
=
=
=
=
=
=
3,000 System Gates
6,000 System Gates
14,000 System Gates
24,000 System Gates
36,000 System Gates
54,000 System Gates
A42MX16
1
PQ
100
ES
User I/Os
PQFP
208-Pin
Device
PLCC
44-Pin
PLCC
68-Pin
PLCC
84-Pin
PQFP
100-Pin
PQFP
160-Pin
PQFP
240-Pin
VQFP
80-Pin
VQFP
100-Pin
TQFP
176-Pin
PBGA
272-Pin
A40MX02
34
57
–
57
–
–
–
57
–
–
–
A40MX04
34
57
69
69
–
–
–
69
–
–
–
A42MX09
–
–
72
83
101
–
–
–
83
104
–
A42MX16
–
–
72
83
125
140
–
–
83
140
–
A42MX24
–
–
72
–
125
176
–
–
–
150
–
A42MX36
–
–
–
–
–
176
202
–
–
–
202
Note: Package Definitions
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad Flat Pack,
PBGA = Plastic Ball Grid Array
相關PDF資料
PDF描述
A42MX36-FPQ100ES 9-Bit to 18-Bit HSTL-to-LVTTL Memory Address Latch With Input Pullup Resistors 48-TSSOP 0 to 70
A42MX36-FPQ100I Quad 2-input positive-NAND gates 14-SOIC 0 to 70
A42MX36-FPQ100M 40MX and 42MX FPGA Families
A42MX36-FTQ100 Quad 2-input positive-NAND gates 14-SSOP 0 to 70
A42MX36-FTQ100A Quad 2-input positive-NAND gates 14-SSOP 0 to 70
相關代理商/技術參數(shù)
參數(shù)描述
A42MX36-FPQ208 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
A42MX36-FPQ240 功能描述:IC FPGA MX SGL CHIP 54K 240-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
A42MX36-FPQG208 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
A42MX36-FPQG240 功能描述:IC FPGA MX SGL CHIP 54K 240-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
A42MX36-PQ208 功能描述:IC FPGA MX SGL CHIP 54K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
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