EQ 2-14 where: EQ 2-15 A heat sink wi" />
參數(shù)資料
型號(hào): A54SX08A-FG144A
廠商: Microsemi SoC
文件頁(yè)數(shù): 36/108頁(yè)
文件大?。?/td> 0K
描述: IC FPGA SX 12K GATES 144-FBGA
標(biāo)準(zhǔn)包裝: 160
系列: SX-A
LAB/CLB數(shù): 768
輸入/輸出數(shù): 111
門數(shù): 12000
電源電壓: 2.25 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 144-LBGA
供應(yīng)商設(shè)備封裝: 144-FPBGA(13x13)
SX-A Family FPGAs
v5.3
2-13
To determine the heat sink's thermal performance, use the following equation:
EQ 2-14
where:
EQ 2-15
A heat sink with a thermal resistance of 9.76°C/W or better should be used. Thermal resistance of heat sinks is a
function of airflow. The heat sink performance can be significantly improved with the presence of airflow.
Carefully estimating thermal resistance is important in the long-term reliability of an Actel FPGA. Design engineers
should always correlate the power consumption of the device with the maximum allowable power dissipation of the
package selected for that device, using the provided thermal resistance data.
Note: The values may vary depending on the application.
θ
JA(TOTAL)
θ
JC
θ
CS
θ
SA
++
=
θ
CS =
0.37°C/W
=
thermal resistance of the interface material between the case and the heat
sink, usually provided by the thermal interface manufacturer
θ
SA =
thermal resistance of the heat sink in °C/W
θ
SA
θ
JA(TOTAL)
θ
JC
θ
CS
=
θ
SA
13.33
°C/W 3.20°C/W
0.37
°C/W
=
θ
SA
9.76
°C/W
=
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A54SX08AFG144I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Logic IC
A54SX08A-FG144I 功能描述:IC FPGA SX 12K GATES 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)
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