
v3.1
3
5 4 S X F a m ily F P G A s
P roduc t P la n
Speed Grade*
Application
Std
–1
–2
–3
C
I
M
A54SX08 Device
84-Pin Plastic Leaded Chip Carrier (PLCC)
100-Pin Very Thin Plastic Quad Flat Pack (VQFP)
144-Pin Thin Quad Flat Pack (TQFP)
144-Pin Fine Pitch Ball Grid Array (FBGA)
176-Pin Thin Quad Flat Pack (TQFP)
208-Pin Plastic Quad Flat Pack (PQFP)
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—
—
—
—
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A54SX16 Device
100-Pin Very Thin Plastic Quad Flat Pack (VQFP)
176-Pin Thin Quad Flat Pack (TQFP)
208-Pin Plastic Quad Flat Pack (PQFP)
P
P
P
A54SX16P Device
100-Pin Very Thin Plastic Quad Flat Pack (VQFP)
144-Pin Thin Quad Flat Pack (TQFP)
176-Pin Thin Quad Flat Pack (TQFP)
208-Pin Plastic Quad Flat Pack (PQFP)
—
—
—
—
A54SX32 Device
144-Pin Thin Quad Flat Pack (TQFP)
176-Pin Thin Quad Flat Pack (TQFP)
208-Pin Plastic Quad Flat Pack (PQFP)
313-Pin Plastic Ball Grid Array (PBGA)
329-Pin Plastic Ball Grid Array (PBGA)
Contact your Actel sales representative for product availability.
Applications:C = CommercialAvailability:
I
= Industrial
M
= Military
P
P
P
—
—
=
=
=
Available*Speed Grade:–1
Planned
Not Planned
Only Std, –1, –2 Speed Grade
Only Std, –1 Speed Grade
=
=
=
Approx. 15%faster than Standard
Approx. 25%faster than Standard
Approx. 35%faster than Standard
P
—
–2
–3
P la s t ic De v ic e R e s ourc e s
User I/Os (including clock buffers)
Device
PLCC
84-Pin
VQFP
100-Pin
PQFP
208-Pin
TQFP
144-Pin
TQFP
176-Pin
PBGA
313-Pin
PBGA
329-Pin
FBGA
144-Pin
A54SX08
A54SX16
A54SX16P
A54SX32
Package Definitions
(Consult your local Actel sales representative for product availability.)
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad Flat Pack,
PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch (1.0 mm) Ball Grid Array
69
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81
81
81
—
130
175
175
174
113
—
113
113
128
147
147
147
—
—
—
249
—
—
—
249
111
—
—
—