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參數(shù)資料
| 型號： | A54SX16A-FFGG144 |
| 廠商： | Microsemi SoC |
| 文件頁數(shù)： | 20/108頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA SX 24K GATES 144-FBGA |
| 標準包裝： | 160 |
| 系列： | SX-A |
| LAB/CLB數(shù)： | 1452 |
| 輸入/輸出數(shù)： | 111 |
| 門數(shù)： | 24000 |
| 電源電壓： | 2.25 V ~ 5.25 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 144-LBGA |
| 供應(yīng)商設(shè)備封裝： | 144-FPBGA（13x13） |
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SX-A Family FPGAs
v5.3
1-15
Pin Description
CLKA/B, I/O
Clock A and B
These pins are clock inputs for clock distribution
networks. Input levels are compatible with standard TTL,
LVTTL, LVCMOS2, 3.3 V PCI, or 5 V PCI specifications. The
clock input is buffered prior to clocking the R-cells. When
not used, this pin must be tied Low or High (NOT left
floating) on the board to avoid unwanted power
consumption.
For A54SX72A, these pins can also be configured as user
I/Os. When employed as user I/Os, these pins offer built-
in programmable pull-up or pull-down resistors active
during power-up only. When not used, these pins must
be tied Low or High (NOT left floating).
QCLKA/B/C/D, I/O
Quadrant Clock A, B, C, and D
These four pins are the quadrant clock inputs and are
only
used
for
A54SX72A
with
A,
B,
C,
and
D
corresponding to bottom-left, bottom-right, top-left,
and top-right quadrants, respectively. They are clock
inputs for clock distribution networks. Input levels are
compatible with standard TTL, LVTTL, LVCMOS2, 3.3 V
PCI, or 5 V PCI specifications. Each of these clock inputs
can drive up to a quarter of the chip, or they can be
grouped together to drive multiple quadrants. The clock
input is buffered prior to clocking the R-cells. When not
used, these pins must be tied Low or High on the board
(NOT left floating).
These pins can also be configured as user I/Os. When
employed
as
user
I/Os,
these
pins
offer
built-in
programmable pull-up or pull-down resistors active
during power-up only.
GND
Ground
Low supply voltage.
HCLK
Dedicated (Hardwired)
Array Clock
This pin is the clock input for sequential modules. Input
levels
are
compatible
with
standard
TTL,
LVTTL,
LVCMOS2, 3.3 V PCI, or 5 V PCI specifications. This input is
directly wired to each R-cell and offers clock speeds
independent of the number of R-cells being driven.
When not used, HCLK must be tied Low or High on the
board (NOT left floating). When used, this pin should be
held Low or High during power-up to avoid unwanted
static power consumption.
I/O
Input/Output
The I/O pin functions as an input, output, tristate, or
bidirectional buffer. Based on certain configurations,
input and output levels are compatible with standard
TTL, LVTTL, LVCMOS2, 3.3 V PCI or 5 V PCI specifications.
Unused I/O pins are automatically tristated by the
Designer software.
NC
No Connection
This pin is not connected to circuitry within the device
and can be driven to any voltage or be left floating with
no effect on the operation of the device.
PRA/B, I/O
Probe A/B
The Probe pin is used to output data from any user-
defined design node within the device. This independent
diagnostic pin can be used in conjunction with the other
probe pin to allow real-time diagnostic output of any
signal path within the device. The Probe pin can be used
as a user-defined I/O when verification has been
completed.
The
pin’s
probe
capabilities
can
be
permanently disabled to protect programmed design
confidentiality.
TCK, I/O
Test Clock
Test clock input for diagnostic probe and device
programming. In Flexible mode, TCK becomes active
when the TMS pin is set Low (refer to Table 1-6 on
page 1-9). This pin functions as an I/O when the
boundary scan state machine reaches the "logic reset"
state.
TDI, I/O
Test Data Input
Serial input for boundary scan testing and diagnostic
probe. In Flexible mode, TDI is active when the TMS pin is
set Low (refer to Table 1-6 on page 1-9). This pin
functions as an I/O when the boundary scan state
machine reaches the “l(fā)ogic reset” state.
TDO, I/O
Test Data Output
Serial output for boundary scan testing. In flexible mode,
TDO is active when the TMS pin is set Low (refer to
Table 1-6 on page 1-9). This pin functions as an I/O when
the boundary scan state machine reaches the "logic
reset" state. When Silicon Explorer II is being used, TDO
will act as an output when the checksum command is
run. It will return to user /IO when checksum is complete.
TMS
Test Mode Select
The TMS pin controls the use of the IEEE 1149.1
Boundary Scan pins (TCK, TDI, TDO, TRST). In flexible
mode when the TMS pin is set Low, the TCK, TDI, and
TDO pins are boundary scan pins (refer to Table 1-6 on
page 1-9). Once the boundary scan pins are in test mode,
they will remain in that mode until the internal
boundary scan state machine reaches the logic reset
state. At this point, the boundary scan pins will be
released and will function as regular I/O pins. The logic
reset state is reached five TCK cycles after the TMS pin is
set High. In dedicated test mode, TMS functions as
specified in the IEEE 1149.1 specifications.
TRST, I/O
Boundary Scan Reset Pin
Once it is configured as the JTAG Reset pin, the TRST pin
functions as an active low input to asynchronously
initialize or reset the boundary scan circuit. The TRST pin
is equipped with an internal pull-up resistor. This pin
functions as an I/O when the Reserve JTAG Reset Pin is
not selected in Designer.
VCCI
Supply Voltage
Supply voltage for I/Os. See Table 2-2 on page 2-1. All
VCCI power pins in the device should be connected.
VCCA
Supply Voltage
Supply voltage for array. See Table 2-2 on page 2-1. All
VCCA power pins in the device should be connected.
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| A54SX16A-FFGG256 | 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A54SX16A-FG144 | 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A54SX16A-FG144A | 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A54SX16A-FG144I | 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A54SX16A-FG144M | 制造商:Microsemi Corporation 功能描述:FPGA SX-A 16K GATES 924 CELLS 227MHZ 0.25UM/0.22UM 2.5V 144F - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 24K GATES 144FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 111 I/O 144FBGA |
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