Figure 1-13 Output Buffer Delays Figure 1-14 AC Test Loads To AC Test Loads (shown below) PAD D E TRIBUFF I" />
參數(shù)資料
型號: A54SX32-2BG313I
廠商: Microsemi SoC
文件頁數(shù): 19/64頁
文件大?。?/td> 0K
描述: IC FPGA SX 48K GATES 313-BGA
標(biāo)準(zhǔn)包裝: 24
系列: SX
LAB/CLB數(shù): 2880
輸入/輸出數(shù): 249
門數(shù): 48000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 313-BBGA
供應(yīng)商設(shè)備封裝: 313-PBGA(35x35)
SX Family FPGAs
1- 22
v3.2
Figure 1-13 Output Buffer Delays
Figure 1-14 AC Test Loads
To AC Test Loads (shown below)
PAD
D
E
TRIBUFF
In
50%
Out
V
OL
1.5 V
50%
1.5 V
En
50%
Out
V
OL
1.5 V
50%
10%
En
50%
Out
GND
1.5 V
50%
90%
t
DLH
t
DHL
t
ENZL
t
ENLZ
t
ENZH
t
ENHZ
V
OH
V
OH
GND
VCC
GND
V
CC
V
CC
V
CC
GND
Load 2
(used to measure
disable delays)
V
CC
GND
35 pF
R to VCC for tPLZ
R to GND for t
PHZ
R = 1 k
Ω
Load 1
(used to measure
propagation delay)
Load 2
(used to measure
enable delays)
35 pF
To Output
Under Test
V
CC
GND
35 pF
R to V
CC for tPLZ
R to GND for t
PHZ
R = 1 k
Ω
To Output
Under Test
To Output
Under Test
Figure 1-15 Input Buffer Delays
PAD
Y
INBUF
In
3 V
0 V
1.5 V
Out
GND
V
CC
50%
t
INY
1.5 V
50%
t
INY
Figure 1-16 C-Cell Delays
S
A
B
Y
S, A ,or B
Out
50%
t
PD
Out
50%
t
PD
tPD
t
PD
V
CC
GND
VCC
GND
V
CC
相關(guān)PDF資料
PDF描述
RSC60DRTF CONN EDGECARD 120PS DIP .100 SLD
A42MX36-1PQ240 IC FPGA MX SGL CHIP 54K 240-PQFP
A42MX36-1PQG240 IC FPGA MX SGL CHIP 54K 240-PQFP
A42MX36-PQG208I IC FPGA MX SGL CHIP 54K 208-PQFP
IDT71V424S15PHGI IC SRAM 4MBIT 15NS 44TSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX32-2BG329 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
A54SX32-2BG329I 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
A54SX32-2BG329IX3 制造商:Microsemi Corporation 功能描述:FPGA SX Family 32K Gates 1800 Cells 320MHz 0.35um Technology 3.3V/5V 329-Pin BGA 制造商:Microsemi Corporation 功能描述:54SX 32K GATES 1800 MC 320MHZ IND CMOS 3.3/5V 329 BGA - Trays
A54SX32-2BGG329 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
A54SX32-2BGG329I 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)