參數(shù)資料
型號: A54SX32-2BG329
廠商: Microsemi SoC
文件頁數(shù): 60/64頁
文件大?。?/td> 0K
描述: IC FPGA SX 48K GATES 329-BGA
標準包裝: 27
系列: SX
LAB/CLB數(shù): 2880
輸入/輸出數(shù): 249
門數(shù): 48000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 329-BBGA
供應商設備封裝: 329-PBGA(31x31)
54SX Family FPGAs
v3.2
3-1
Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Datasheet Categories
In order to provide the latest information to designers, some datasheets are published before data has been fully
characterized. Datasheets are designated as "Product Brief," "Advanced," "Production," and "Datasheet
Supplement." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advanced or production) containing general product
information. This brief gives an overview of specific device and family information.
Advanced
This datasheet version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production.
Unmarked (production)
This datasheet version contains information that is considered to be final.
Datasheet Supplement
The datasheet supplement gives specific device information for a derivative family that differs from the general family
datasheet. The supplement is to be used in conjunction with the datasheet to obtain more detailed information and
for specifications that do not differ between the two families.
International Traffic in Arms Regulations (ITAR) and Export
Administration Regulations (EAR)
The products described in this datasheet are subject to the International Traffic in Arms Regulations (ITAR) or the
Export Administration Regulations (EAR). They may require an approved export license prior to their export. An export
can include a release or disclosure to a foreign national inside or outside the United States.
Previous Version Changes in Current Version (v3.2)
Page
v3.1
(June 2003)
The "Ordering Information" was updated to include RoHS information.
The Product Plan was removed since all products have been released.
N/A
Information concerning the TRST pin in the "Probe Circuit Control Pins" section was removed.
A note was added to the "Power-Up Sequencing" table.
A note was added to the "Power-Down Sequencing" table. The 3.3 V comments were updated for the
following devices: A54SX08, A54SX16, A54SX32.
U11 and U13 were added to the "313-Pin PBGA" table.
v3.0.1
Storage temperature in Table 1-3 was updated.
Table 1-1 was updated.
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相關代理商/技術參數(shù)
參數(shù)描述
A54SX32-2BG329I 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA(23x23)
A54SX32-2BG329IX3 制造商:Microsemi Corporation 功能描述:FPGA SX Family 32K Gates 1800 Cells 320MHz 0.35um Technology 3.3V/5V 329-Pin BGA 制造商:Microsemi Corporation 功能描述:54SX 32K GATES 1800 MC 320MHZ IND CMOS 3.3/5V 329 BGA - Trays
A54SX32-2BGG329 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA(23x23)
A54SX32-2BGG329I 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA(23x23)
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