參數(shù)資料
型號: A54SX32-2TQ144
英文描述: Field Programmable Gate Array (FPGA)
中文描述: 現(xiàn)場可編程門陣列(FPGA)
文件頁數(shù): 12/36頁
文件大?。?/td> 833K
代理商: A54SX32-2TQ144
54SX Family FPGAs RadTolerant and HiRel
12
v2.0
Power-Up Sequencing
RT54SX16, A54SX16, RT54SX32, A54SX32
Power-Down Sequencing
RT54SX16, A54SX16, RT54SX32, A54SX32
Package Thermal Characteristics
The device junction to case thermal characteristic is
θ
jc
,
and the junction to ambient air characteristic is
θ
ja
. The
thermal characteristics for
θ
ja
are shown with two different
air flow rates.
Maximum junction temperature is 150
°
C.
A sample calculation of the absolute maximum power
dissipation allowed for an RT54SX16 in a CQFP 256-pin
package at military temperature and still air is as follows:
V
CCA
V
CCR
V
CCI
Power-Up Sequence
Comments
3.3V
5.0V
3.3V
5.0V First
3.3V Second
No possible damage to device.
3.3V First
5.0V Second
Possible damage to device.
V
CCA
V
CCR
V
CCI
Power-Down Sequence
Comments
3.3V
5.0V
3.3V
5.0V First
3.3V Second
Possible damage to device.
3.3V First
5.0V Second
No possible damage to device.
Package Type
Pin Count
θ
jc
θ
ja
Still Air
Units
RT54SX16
Ceramic Quad Flat Pack (CQFP)
208
7.5
29
°
C/W
°
C/W
Ceramic Quad Flat Pack (CQFP)
256
4.6
23
RT54SX32
Ceramic Quad Flat Pack (CQFP)
208
6.9
35
°
C/W
°
C/W
Ceramic Quad Flat Pack (CQFP)
256
3.5
20
A54SX16
Ceramic Quad Flat Pack (CQFP)
208
7.9
30
°
C/W
°
C/W
Ceramic Quad Flat Pack (CQFP)
256
5.6
25
A54SX32
Ceramic Quad Flat Pack (CQFP)
208
7.6
30
°
C/W
°
C/W
Ceramic Quad Flat Pack (CQFP)
256
4.8
24
Absolute Maximum Power Allowed
ja
(°C/W)
Max. junction temp. (°C) – Max. ambient temp. (°C)
23°C/W
150°C – 125°C
1.09W
=
=
=
相關PDF資料
PDF描述
A54SX32-2TQ144I Field Programmable Gate Array (FPGA)
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A54SX08-1FG144I Field Programmable Gate Array (FPGA)
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A54SX32-2TQG144 功能描述:IC FPGA SX 48K GATES 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA(23x23)
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