參數(shù)資料
型號(hào): A54SX32-CQ256M
廠商: Microsemi SoC
文件頁(yè)數(shù): 12/64頁(yè)
文件大小: 0K
描述: IC FPGA SX 48K GATES 256-CQFP
標(biāo)準(zhǔn)包裝: 1
系列: SX
LAB/CLB數(shù): 2880
輸入/輸出數(shù): 203
門(mén)數(shù): 48000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類(lèi)型: 表面貼裝
工作溫度: -55°C ~ 125°C
封裝/外殼: 256-BFCQFP 裸露焊盤(pán)和拉桿
供應(yīng)商設(shè)備封裝: 256-CQFP(75x75)
SX Family FPGAs
ii
v3.2
Ordering Information
Plastic Device Resources
Part Number
A54SX08 = 12,000 System Gates
A54SX16 = 24,000 System Gates
A54SX16P = 24,000 System Gates
A54SX32 = 48,000 System Gates
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard
Package Type
BG = Ball Grid Array
PL = Plastic Leaded Chip Carrier
PQ = Plastic Quad Flat Pack
TQ = Thin (1.4 mm) Quad Flat Pack
VQ = Very Thin (1.0 mm) Quad Flat Pack
FG = Fine Pitch Ball Grid Array (1.0 mm)
Package Lead Count
Application (Temperature Range)
Blank = Commercial (0 to +70C)
I = Industrial (–40 to +85C)
M = Military (–55 to +125C)
PP = Pre-production
A54SX16
P
2
PQ
208
Blank = Not PCI Compliant
P = PCI Compliant
G
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Device
User I/Os (including clock buffers)
PLCC
84-Pin
VQFP
100-Pin
PQFP
208-Pin
TQFP
144-Pin
TQFP
176-Pin
PBGA
313-Pin
PBGA
329-Pin
FBGA
144-Pin
A54SX08
69
81
130
113
128
111
A54SX16
81
175
147
A54SX16P
81
175
113
147
A54SX32
174
113
147
249
Note: Package Definitions (Consult your local Actel sales representative for product availability):
PLCC = Plastic Leaded Chip Carrier
PQFP = Plastic Quad Flat Pack
TQFP = Thin Quad Flat Pack
VQFP = Very Thin Quad Flat Pack
PBGA = Plastic Ball Grid Array
FBGA = Fine Pitch (1.0 mm) Ball Grid Array
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