Table 2-34 A54SX32A Timing Characteristics (Worst-Case Commercial Conditions V
參數(shù)資料
型號: A54SX32A-FBGG329
廠商: Microsemi SoC
文件頁數(shù): 67/108頁
文件大?。?/td> 0K
描述: IC FPGA SX 48K GATES 329-BGA
標準包裝: 27
系列: SX-A
LAB/CLB數(shù): 2880
輸入/輸出數(shù): 249
門數(shù): 48000
電源電壓: 2.25 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 329-BBGA
供應商設(shè)備封裝: 329-PBGA(31x31)
SX-A Family FPGAs
v5.3
2-41
Table 2-34 A54SX32A Timing Characteristics
(Worst-Case Commercial Conditions VCCA = 2.25 V, VCCI = 4.75 V, TJ = 70°C)
Parameter
Description
–3 Speed1
–2 Speed
–1 Speed
Std. Speed
–F Speed
Units
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
5 V PCI Output Module Timing2
tDLH
Data-to-Pad Low to High
2.1
2.4
2.8
3.2
4.5
ns
tDHL
Data-to-Pad High to Low
2.8
3.2
3.6
4.2
5.9
ns
tENZL
Enable-to-Pad, Z to L
1.3
1.5
1.7
2.0
2.8
ns
tENZH
Enable-to-Pad, Z to H
2.1
2.4
2.8
3.2
4.5
ns
tENLZ
Enable-to-Pad, L to Z
3.0
3.5
3.9
4.6
6.4
ns
tENHZ
Enable-to-Pad, H to Z
2.8
3.2
3.6
4.2
5.9
ns
dTLH
3
Delta Low to High
0.016
0.02
0.022
0.032
ns/pF
dTHL
3
Delta High to Low
0.026
0.03
0.032
0.04
0.052
ns/pF
5 V TTL Output Module Timing4
tDLH
Data-to-Pad Low to High
1.9
2.2
2.5
2.9
4.1
ns
tDHL
Data-to-Pad High to Low
2.5
2.9
3.3
3.9
5.4
ns
tDHLS
Data-to-Pad High to Low—low slew
6.6
7.6
8.6
10.1
14.2
ns
tENZL
Enable-to-Pad, Z to L
2.1
2.4
2.7
3.2
4.5
ns
tENZLS
Enable-to-Pad, Z to L—low slew
7.4
8.4
9.5
11.0
15.4
ns
tENZH
Enable-to-Pad, Z to H
1.9
2.2
2.5
2.9
4.1
ns
tENLZ
Enable-to-Pad, L to Z
3.6
4.2
4.7
5.6
7.8
ns
tENHZ
Enable-to-Pad, H to Z
2.5
2.9
3.3
3.9
5.4
ns
dTLH
3
Delta Low to High
0.014
0.017
0.023
0.031
ns/pF
dTHL
3
Delta High to Low
0.023
0.029
0.031
0.037
0.051
ns/pF
dTHLS
3
Delta High to Low—low slew
0.043
0.046
0.057
0.066
0.089
ns/pF
Notes:
1. All –3 speed grades have been discontinued.
2. Delays based on 50 pF loading.
3. To obtain the slew rate, substitute the appropriate Delta value, load capacitance, and the VCCI value into the following equation:
Slew Rate [V/ns] = (0.1*VCCI – 0.9*VCCI)/ (Cload * dT[LH|HL|HLS])
where Cload is the load capacitance driven by the I/O in pF
dT[LH|HL|HLS] is the worst case delta value from the datasheet in ns/pF.
4. Delays based on 35 pF loading.
相關(guān)PDF資料
PDF描述
A54SX32A-FBG329 IC FPGA SX 48K GATES 329-BGA
GSC36DTEI CONN EDGECARD 72POS .100 EYELET
M1AFS600-FG256 IC FPGA 4MB FLASH 600K 256-FBGA
M1AGL600V2-FG484 IC FPGA 1KB FLASH 600K 484-FBGA
M1AGL600V2-FGG484 IC FPGA 1KB FLASH 600K 484-FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX32A-FFG144 功能描述:IC FPGA SX 48K GATES 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設(shè)備封裝:256-FPBGA(17x17)
A54SX32A-FFG256 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設(shè)備封裝:256-FPBGA(17x17)
A54SX32A-FFG484 功能描述:IC FPGA SX 48K GATES 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-FFGG144 功能描述:IC FPGA SX 48K GATES 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設(shè)備封裝:256-FPBGA(17x17)
A54SX32A-FFGG256 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設(shè)備封裝:256-FPBGA(17x17)