參數(shù)資料
型號(hào): A54SX32A3FG256
英文描述: Logic IC
中文描述: 邏輯IC
文件頁數(shù): 18/36頁
文件大?。?/td> 833K
代理商: A54SX32A3FG256
54SX Family FPGAs RadTolerant and HiRel
18
v2.0
A54SX16 Timing Characteristics
(Worst-Case Military Conditions, V
CCR
= 4.75V, V
CCA,
V
CCI
= 3.0V, T
J
= 125
°
C)
C-Cell Propagation Delays
1
‘–
1
Speed
Std
Speed
Parameter
Description
Min.
Max.
Min.
Max.
Units
t
PD
Predicted Routing Delays
2
Internal Array Module
0.9
1.0
ns
t
DC
t
FC
t
RD1
t
RD2
t
RD3
t
RD4
t
RD8
t
RD12
t
RD18
t
RD24
FO=1 Routing Delay, Direct Connect
0.1
0.1
ns
FO=1 Routing Delay, Fast Connect
0.6
0.7
ns
FO=1 Routing Delay
0.7
0.8
ns
FO=2 Routing Delay
1.2
1.4
ns
FO=3 Routing Delay
1.7
2.0
ns
FO=4 Routing Delay
2.2
2.6
ns
FO=8 Routing Delay
4.3
5.0
ns
FO=12 Routing Delay
5.6
6.6
ns
FO=18 Routing Delay
9.4
11.0
ns
FO=24 Routing Delay
12.4
14.6
ns
R-Cell Timing
t
RCO
t
CLR
t
SUD
t
HD
t
WASYN
Sequential Clock-to-Q
0.6
0.8
ns
Asynchronous Clear-to-Q
0.6
0.8
ns
Flip-Flop Data Input Set-Up
0.8
0.9
ns
Flip-Flop Data Input Hold
0.0
0.0
ns
Asynchronous Pulse Width
2.4
2.9
ns
I/O Module Input Propagation Delays
t
INYH
t
INYL
Predicted Input Routing Delays
3
Input Data Pad-to-Y HIGH
2.2
2.6
ns
Input Data Pad-to-Y LOW
2.2
2.6
ns
t
IRD1
t
IRD2
t
IRD3
t
IRD4
t
IRD8
t
IRD12
t
IRD18
t
IRD24
Notes:
1.
2.
FO=1 Routing Delay
0.7
0.8
ns
FO=2 Routing Delay
1.2
1.4
ns
FO=3 Routing Delay
1.7
2.0
ns
FO=4 Routing Delay
2.2
2.6
ns
FO=8 Routing Delay
4.3
5.0
ns
FO=12 Routing Delay
5.6
6.6
ns
FO=18 Routing Delay
9.4
11.0
ns
FO=24 Routing Delay
12.4
14.6
ns
For dual-module macros, use t
PD
+ t
RD1
+ t
PDn
, t
RCO
+ t
RD1
+ t
PDn
or t
PD1
+ t
RD1
+ t
SUD
, whichever is appropriate.
Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device
performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is
based on actual routing delay measurements performed on the device prior to shipment.
Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device
performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is
based on actual routing delay measurements performed on the device prior to shipment.
3.
相關(guān)PDF資料
PDF描述
A54SX32AFG144 Logic IC
A54SX32AFG144I Logic IC
A54SX32AFG144M Logic IC
A54SX32AFG256 Logic IC
A54SX32AFG256I Logic IC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX32A-BG329 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-BG329I 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
A54SX32A-BG329M 制造商:Microsemi Corporation 功能描述:FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 329-Pin BGA 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 238MHZ 0.25UM/0.22UM 2.5V 329 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 48K GATES 329PBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 249 I/O 329PBGA
A54SX32A-BG329PI85 制造商:Microsemi Corporation 功能描述:FPGA SX-A 32K GATES 1800 CELLS 238MHZ 0.25UM/0.22UM 2.5V 329 - Trays
A54SX32A-BGG329 功能描述:IC FPGA 249I/O 329PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:SX-A 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA(23x23) 其它名稱:220-1241