參數(shù)資料
型號(hào): A54SX32P-1TQ208
廠商: Electronic Theatre Controls, Inc.
元件分類: FPGA
英文描述: 54SX Family FPGAs
中文描述: 54SX家庭的FPGA
文件頁數(shù): 21/57頁
文件大?。?/td> 415K
代理商: A54SX32P-1TQ208
v3.1
21
5 4 S X F a m ily F P G A s
J unc t ion T e m pe ra t ure (T
J
)
The temperature that you select in Designer Series software
is the junction temperature, not ambient temperature. This
is an important distinction because the heat generated from
dynamic power consumption is usually hotter than the
ambient temperature. Use the equation below to calculate
junction temperature.
Junction Temperature =
T + T
a
Where:
T
a
= Ambient Temperature
T = Temperature gradient between junction (silicon) and
ambient
T =
θ
ja
* P
P = Power calculated from Estimating Power Consumption
section
θ
ja
= Junction to ambient of package.
θ
ja
numbers are
located in Package Thermal Characteristics section.
P a c k a g e T he rm a l C ha ra c t e ris t ic s
The device junction to case thermal characteristic is
θ
jc
,
and the junction to ambient air characteristic is
θ
ja
. The
thermal characteristics for
θ
ja
are shown with two different
air flow rates.
The maximum junction temperature is 150
°
C.
A sample calculation of the absolute maximum power
dissipation allowed for a TQFP 176-pin package at
commercial temperature and still air is as follows:
Package Type
Pin Count
θ
jc
12
11
11
10
8
3.8
3
3
3
3.8
θ
ja
Still Air
θ
ja
300 ft/min
Units
Plastic Leaded Chip Carrier (PLCC)
Thin Quad Flat Pack (TQFP)
Thin Quad Flat Pack (TQFP)
Very Thin Quad Flatpack (VQFP)
Plastic Quad Flat Pack (PQFP) without Heat Spreader
Plastic Quad Flat Pack (PQFP) with Heat Spreader
Plastic Ball Grid Array (PBGA)
Plastic Ball Grid Array (PBGA)
Plastic Ball Grid Array (PBGA)
Fine Pitch Ball Grid Array (FBGA)
Note:
SX08 does not have a heat spreader.
84
144
176
100
208
208
272
313
329
144
32
32
28
38
30
20
20
23
18
38.8
22
24
21
32
23
17
14.5
17
13.5
26.7
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
Maximum Power Allowed
ja
(°C/W)
Max. junction temp. (°C) – Max. ambient temp. (°C)
28°C/W
150°C – 70°C
2.86W
=
=
=
相關(guān)PDF資料
PDF描述
A54SX16PP-1VQ208M 54SX Family FPGAs
A54SX32P-1VQ208M 54SX Family FPGAs
A54SX08-1VQ208PP 54SX Family FPGAs
A54SX08-1VQ208 54SX Family FPGAs
A54SX16-1VQ208 54SX Family FPGAs
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX32-PQ208 功能描述:IC FPGA SX 48K GATES 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
A54SX32-PQ208I 功能描述:IC FPGA SX 48K GATES 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
A54SX32-PQ208M 功能描述:IC FPGA SX 48K GATES 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
A54SX32-PQG208 功能描述:IC FPGA SX 48K GATES 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
A54SX32-PQG208I 功能描述:IC FPGA SX 48K GATES 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)