參數(shù)資料
型號(hào)： A54SX72A-PQ208
廠商： Microsemi SoC
文件頁(yè)數(shù)： 30/108頁(yè)
文件大小： 0K
描述： IC FPGA SX-A 108K 208-PQFP
標(biāo)準(zhǔn)包裝： 24
系列： SX-A
LAB/CLB數(shù)： 6036
輸入/輸出數(shù)： 171
門數(shù)： 108000
電源電壓： 2.25 V ~ 5.25 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 208-BFQFP
供應(yīng)商設(shè)備封裝： 208-PQFP（28x28）
SX-A Family FPGAs
2- 8
v5.3
Power Dissipation
A critical element of system reliability is the ability of electronic devices to safely dissipate the heat generated during
operation. The thermal characteristics of a circuit depend on the device and package used, the operating temperature,
the operating current, and the system's ability to dissipate heat.
A complete power evaluation should be performed early in the design process to help identify potential heat-related
problems in the system and to prevent the system from exceeding the device’s maximum allowed junction
temperature.
The actual power dissipated by most applications is significantly lower than the power the package can dissipate.
However, a thermal analysis should be performed for all projects. To perform a power evaluation, follow these steps:
1. Estimate the power consumption of the application.
2. Calculate the maximum power allowed for the device and package.
3. Compare the estimated power and maximum power values.
Estimating Power Dissipation
The total power dissipation for the SX-A family is the sum of the DC power dissipation and the AC power dissipation:
PTotal = PDC + PAC
EQ 2-5
DC Power Dissipation
The power due to standby current is typically a small component of the overall power. An estimation of DC power
dissipation under typical conditions is given by:
PDC = IStandby * VCCA
EQ 2-6
Note: For other combinations of temperature and voltage settings, refer to the eX, SX-A and RT54SX-S Power
AC Power Dissipation
The power dissipation of the SX-A family is usually dominated by the dynamic power dissipation. Dynamic power
dissipation is a function of frequency, equivalent capacitance, and power supply voltage. The AC power dissipation is
defined as follows:
PAC = PC-cells + PR-cells + PCLKA + PCLKB + PHCLK + POutput Buffer + PInput Buffer
EQ 2-7
or:
EQ 2-8
PAC =
VCCA
2 * [(m * C
EQCM * fm)C-cells + (m * CEQSM * fm)R-cells + (n * CEQI * fn)Input Buffer + (p * (CEQO + CL) * fp)Output Buffer
+ (0.5 * (q1 * CEQCR * fq1) + (r1 * fq1))CLKA + (0.5 * (q2 * CEQCR * fq2)+ (r2 * fq2))CLKB + (0.5 * (s1 * CEQHV * fs1) +
(CEQHF * fs1))HCLK]
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A54SX72A-PQ208A 功能描述:IC FPGA SX-A 108K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:SX-A 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
A54SX72A-PQ208I 功能描述:IC FPGA SX-A 108K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:SX-A 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
A54SX72A-PQ208IX160 制造商:Microsemi Corporation 功能描述:FPGA SX-A 72K GATES 4024 CELLS 217MHZ 0.25UM/0.22UM 2.5V 208 - Trays
A54SX72A-PQ208IX3 制造商:Microsemi Corporation 功能描述:FPGA SX-A 72K GATES 4024 CELLS 217MHZ 0.25UM/0.22UM 2.5V 208 - Trays
A54SX72A-PQ208IX60 制造商:Microsemi Corporation 功能描述:FPGA SX-A 72K GATES 4024 CELLS 217MHZ 0.25UM/0.22UM 2.5V 208 - Trays
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