參數(shù)資料
型號(hào)： A7001AGHN1
廠商： NXP Semiconductors N.V.
元件分類： 數(shù)字信號(hào)處理
英文描述： A700x family Secure authentication microcontroller
文件頁數(shù)： 8/19頁
文件大小： 207K
代理商： A7001AGHN1
A700X_FAM_SDS
Preliminary short data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Rev. 2.0 — 25 August 2011
202020
8 of 19
NXP Semiconductors
A700x family
Secure authentication microcontroller
5. Ordering information
[1]
a = A or C, g = G, C or A, according to the A700x family type classification see
Section 1.2 “A700x family naming conventions”
[2]
Available on request with lead time. Please contact your local NXP Sales representative.
5.1 Ordering options
Table 4
gives an overview of available A700x family product types
Table 5
. shows JCOP features.
[1]
g = G, C, or A; pp(p) = UA or HN1, according the A700x family type classification see
Section 1.2 “A700x family naming conventions”
[1]
To configure JCOP V2.4.2 R09 to be application backward compatible contact NXP Semiconductors Customer Application Support
(CAS).
5.1.1
Samples and final products
Section 5.1.2
,
Section 5.1.3
and
Section 5.1.4
give details of how to order samples and
final products.
5.1.2
Ordering A700x family
samples
Samples in HVQFN32 package can be ordered from NXP Semiconductors.
Table 3.
Type number
[1]
Ordering information
Package
Name
FFC
Description
8 inch wafer (sawn; 150
m thickness; on film frame carrier;
electronic fail die marking according to SECSII format)
Version
not applicable
A7001agUA/...
A7002agUA/...
A7001agHN3/...
A7002agHN3/...
A7001agHN1/...
A7002agHN1/...
HVSON8
[2]
plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 6
5
0.85 mm
SOT685-1
HVQFN32
plastic thermal enhanced very thin quad flat package; no leads,
32 terminals; body 5
5
0.85 mm
SOT617-1
Table 4.
Product
type
[1]
A700x family feature table
Operational
ambient
temperature
Free
EEPROM
data
space
72 KB
Transient
Heap
(RAM)
Embedded
OS
AES Triple
DES
RSA
ECC
On
Card
Key
Gen.
yes
SHA1 Interface
option
A7001Agpp(p)
25
C to
+85
C
3550 B
JCOP 2.4.2
R09
yes
yes
2048
320
yes
I
2
C
A7002Agpp(p)
40
C to
+90
C
Table 5.
Product type
JCOP V2.4.2 R09 feature table
Java
Card
Global
Platform
VGP
configurable
1, 2, 3
3
Applet backward
compatible VGP
2.0.1’
[1]
yes
Applet
loading
APDU
Buffer
JCOP V2.4.2 R09
3.0.1
2.1.1
yes
1462 bytes
相關(guān)PDF資料
PDF描述
A7002AGHN1 A700x family Secure authentication microcontroller
AA132 Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:D38999 Series III; No. of Contacts:22; Connector Shell Size:13; Connecting Termination:Crimp; Circular Shell Style:Straight Plug; Body Style:Straight RoHS Compliant: No
AA144 Circular Connector; No. of Contacts:4; Series:D38999; Body Material:Metal; Connecting Termination:Crimp; Connector Shell Size:13; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:13-4
AAT1110 Fast Transient 800mA Step-Down Converter
AAT1110_06 Fast Transient 800mA Step-Down Converter
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A7001AGHN1/T1AG315 功能描述:8位微控制器 -MCU SecureAuthentication MCU RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
A7001AGHN3 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Secure authentication microcontroller 100 kbit/s I2C slave interface
A7001CAHN1/T1AG525 制造商:NXP Semiconductors 功能描述:- Trays
A7001CGHN1/T1AGAEL 功能描述:SECURE AUTHENTICATION MICROCONTR 制造商:nxp usa inc. 系列:* 零件狀態(tài):在售 標(biāo)準(zhǔn)包裝:2,450
A7001CGHN1/T1AGBEL 功能描述:SECURE AUTHENTICATION MICROCONTR 制造商:nxp usa inc. 系列:* 零件狀態(tài):在售 標(biāo)準(zhǔn)包裝:2,450
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*