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參數(shù)資料
| 型號(hào)： | AA028P2-99 |
| 元件分類： | 放大器 |
| 英文描述： | 25000 MHz - 31000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 文件頁數(shù)： | 4/4頁 |
| 文件大小： | 490K |
| 代理商： | AA028P2-99 |
25–31 GHz Amplifier
AA028P2-99
4
Alpha Industries, Inc. [781] 935-5150
Fax [617] 824-4579 Email sales@alphaind.com www.alphaind.com
Specifications subject to change without notice. 2/00A
Co-Planar Millimeterwave Package
Handling and Mounting
Millimeterwave amplifiers require careful mounting design
to maintain optimal performance.
Handling
The co-planar millimeterwave package is very rugged.
However, due to ceramic’s brittle nature one should
exercise care when handling with metal tools. Do not apply
heavy pressure to the lid. Vacuum tools may be used to
pick and place this part.
Only personnel trained in both ESD precautions and
handling precautions should be allowed to handle these
packages.
Package Construction
The co-planar millimeterwave package is constructed from
metal and ceramic. The base of the package is gold-plated
copper-molybdenum-copper. The lid is unplated alumina.
The lid seal is epoxy.
Mounting Design
The co-planar millimeterwave package is mounted by
placing it in a hole cut in a printed circuit board. The RF
interface on the package should be in the same plane as
the surface of the printed circuit board. The hole should
be cut as close as possible to the outer dimensions of the
package to minimize the gap between package and
printed circuit board. The gap should be no more than
0.005" (0.127 mm). The base of the package should be
mounted directly to a surface which provides a good
ground plane for the printed circuit board and provides a
good thermal ground.
The RF connection on the printed circuit board should
include a microstrip line and two grounded pads, one on
either side of the microstrip line. The RF connection
between the package and the printed circuit board should
be accomplished with three ribbon bonds, one connecting
the RF lines on package and printed circuit board and two
connecting the ground pads on the package and printed
circuit board.
Mounting the Package
The package should be attached to its mounting surface
using a silver-filled conductive paste epoxy. Care should
be taken to ensure that there are no voids or gaps in the
epoxy underfill so that a good ground contact is
maintained.
Connecting the Package
Thermosonic ribbon attachment with 0.00025" x 0.005"
(0.0064 mm x 0.127 mm) gold ribbon is used to make the
connections from the RF and DC package interfaces to
the printed circuit board. Lengths of ribbons should be
minimized.
Ribbon Bonds
Minimize RF
Gap Widths
RF In
Grounded Pad on
Printed Circuit Board
DC Lines
Electrically & Thermally
Conductive Ground Plane
RF Out
Printed Circuit Board
Rogers 4003
0.008" (0.20 mm) Thick
Co-Planar Millimeterwave Package Mounting
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