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參數(shù)資料
| 型號： | AB-54008L-175 |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 放大器 |
| 英文描述： | 135 MHz - 175 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER |
| 封裝： | 40 X 20 MM, ROHS COMPLIANT PACKAGE-3 |
| 文件頁數(shù)： | 8/20頁 |
| 文件大?。?/td> | 664K |
| 代理商： | AB-54008L-175 |
Package mechanical data
AB-54008L-175
16/20
6.2
Thermal Pad and Via design SOT-89
Thernal vias are required in the PCB layout to effectively conduct heat away from the
package. The via pattern has been designed to address thermal, power dissipation and
electrical requirements of the device.
The via pattern is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025 plating on via walls. If micro vias are used in a
design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar
results.
Figure 21.
Pad layout details
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