
6
Avago Technologies recommends utilizing the
standard precautions listed below.
1. Calculated Shelf Life in Sealed Bag: 12 months at <
40°C and < 90% Relative Humidity (RH)
2. Peak Package Body Temperature: 250°C
3. After bag is opened, devices that will be subjected
to reflow solder of other high temperature process
must be:
a. Mounted within 168 hours of factory condition
≤
30°C / 60% RH
b. Stored at <10% RH if not used
4. Devices require baking, before mounting if:
a. Humidity indicator card is > 10% when read at
23 ± 5°C immediately after moisture barrier bag
is opened.
b. Items 3a or 3b is not met
5. If baking is required, please refer to J-STD-033
standard for low temperature (40°C) baking
requirement in Tape/Reel form.
Tape Dimensions and Orientation
1.55
±
0.05
1.50 (MIN)
4.38
±
0.10
1.80
±
0.10
4.38
±
0.10
CL
8.00
±
0.10
4.38
±
0.10
2.00
±
0.05
[1]
4.00
±
0.10
[2]
5.50
±
0.05
[3]
12.00
±
0.30
1.75
±
0.10
0.30
±
0.05
Notes:
1. Measured from centerline of sprocket hole to centerline of pocket
2. Cumulative tolerance of 10 sprocket holes is
±
0.2 mm
3. All dimensions in millimeters unless otherwise stated.
Agilent
ACPM-7886
MLYWWDD
XXXX
ESD Sensitivity Level
Human Body Model (EIA/JESD22-A114B):
Class 1A (250Vmin, less than 500V)
Machine Model (EIA/JESD22-A115A):
Class A (50Vmin, less than 200V)
Notes:
ESD Sensitivity level for Human Body Model and
Machine Model necessitate the following
handling precautions:
1. Ensure Faraday cage or conductive shield bag is used during
transportation processes.
2. If the static charge at SMT assemble station is above the device
sensitivity level, place an ionizer near to the device for charge
neutralization purposes.
3. Personal grounding must be worn at all times when handling
the devices.
Moisture Sensitivity Classification: Class 3
Preconditioning per JESD22-A113-D Class 3 was
performed on all devices prior to reliability testing.
ACPM-7886 is a moisture sensitive component. It’s
important that the parts are handled under precaution
and a proper manner. The handling, baking and out-
of-pack storage conditions of the moisture sensitive
components are described in IPC/JEDC S-STD-033A.