參數(shù)資料
型號: ACS244MS
廠商: Intersil Corporation
英文描述: Radiation Hardened Non Inverting, Octal, Three-State Buffer/Line Driver(抗輻射同相、八路三態(tài)緩沖器/線驅(qū)動器)
中文描述: 輻射加固非反相,八,三態(tài)緩沖器/線路驅(qū)動器(抗輻射同相,八路三態(tài)緩沖器/線驅(qū)動器)
文件頁數(shù): 2/2頁
文件大小: 46K
代理商: ACS244MS
2
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil (Taiwan) Ltd.
Taiwan Limited
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
Die Characteristics
DIE DIMENSIONS:
Size: 2540
μ
m x 2540
μ
m (100 mils x 100mils)
Thickness: 525
μ
m
±
25
μ
m (20.6 mils
±
1 mil)
Bond Pad: 110
μ
m x 110
μ
m (4.3 x 4.3 mils)
METALLIZATION:
Al
Metal 1 Thickness: 0.7
μ
m
±
0.1
μ
m
Metal 2 Thickness: 1.0
μ
m
±
0.1
μ
m
SUBSTRATE POTENTIAL:
Unbiased Insulator
PASSIVATION
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30
μ
m
±
0.15
μ
m
SPECIAL INSTRUCTIONS:
Bond V
CC
First
ADDITIONAL INFORMATION:
Worst Case Density: <2.0 x 10
5
A/cm
2
Transistor Count: 214
Metallization Mask Layout
ACS244MS
BO4 (3)
AI2 (4)
BO3 (5)
AI3 (6)
BO2 (7)
AI4 (8)
V
CC
(20)
BO1 (9)
AO4 (12)
(13) BI2
(14) AO3
(15) BI3
(16) AO2
(17) BI4
(18) AO1
V
CC
(20)
AE
(1)
AI1
(2)
BE
(19)
(11)
BI1
(10)
GND
(10)
GND
ACS244MS
相關(guān)PDF資料
PDF描述
ACS244K Radiation Hardened Non-Inverting, Octal, Three-State Buffer/Line Driver
ACS244DMSR-02 Radiation Hardened Non-Inverting, Octal, Three-State Buffer/Line Driver
ACS245D Radiation Hardened Octal Non-Inverting Bidirectional Bus Transceiver
ACS245MS Radiation Hardened Octal Non-Inverting Bidirectional Bus Transceiver(抗輻射八同相雙向總線收發(fā)器)
ACTS245MS Octal Non-Inverting Bidirectional Bus Transceiver(八正相雙向總線接收器)
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