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參數(shù)資料
| 型號： | AD12400 |
| 廠商： | Analog Devices, Inc. |
| 元件分類： | ADC |
| 英文描述： | 12-Bit 400 MSPS A/D Converter |
| 中文描述： | 12位400 MSPS的A / D轉(zhuǎn)換 |
| 文件頁數(shù)： | 17/28頁 |
| 文件大小： | 403K |
| 代理商： | AD12400 |
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AD12400
While this product has been designed to provide good PSRR
performance, systems designers need to be aware of the risks
associated with switching power supplies and consider using
linear regulators in their high speed ADC systems. Switching
power supplies typically produce both conducted and radiated
energy that result in common-/differential-mode EMI currents.
Any system that requires 12-bit performance has very little
room for errors associated with power supply EMI. For
example, a system goal of 74 dB dynamic range performance on
the AD12400 will require noise currents that are less than
4.5 μA and noise voltages of less than 225 μV in the analog
input path.
Rev. 0 | Page 17 of 28
START-UP AND RESET
The AD12400’s FPGA configuration is stored in the on-board
EPROM and loaded into the FPGA when power is applied to
the device. The RESET pin (active low) allows the user to reload
the FPGA in case of a low digital supply voltage condition or a
power supply glitch. Pulling the RESET pin low will pull the
data ready and output bits high until the FPGA has been
reloaded. The RESET pin should remain low for a minimum of
200 ns. On the rising edge of the reset pulse, the AD12400 will
start loading the configuration into the FPGA. The reload
process requires a maximum of 600 ms to complete. Valid
signals on the data ready pins indicate that the reset process is
complete. Also, system designers need be aware of the thermal
conditions of the AD12400 at start-up. If large thermal
imbalances are present, the AD12400 may require additional
time to stabilize before providing specified image spur
performance.
LEAD/LAG
The LEAD/LAG pin is used to synchronize the collection of
data into external buffer memories. The LEAD/LAG pin can be
applied synchronously or asynchronously to the AD12400. If
applied asynchronously, LEAD/LAG must be held high for a
minimum of 5 ns to ensure correct operation. The function will
shut off DRA and DRB until the LEAD/LAG pin is released.
DRA and DRB will resume on the next valid DRA after
LEAD/LAG is released. If this feature is not required, tie this pin
to DGND.
THERMAL CONSIDERATIONS
The module is rated to operate over a case temperature of 0°C
to 60°C. In order to maintain the tight channel matching and
reliability of the AD12400, care must be taken to assure that
proper thermal and mechanical considerations have been made
and addressed to assure case temperature is kept within this
range. Each application will require evaluation of the thermal
management as applicable to the system design. The following
provides information that should be used in the evaluation of
AD12400 thermal management for each specific use.
In addition to the radiation of heat into its environment, the
AD12400 module enables flow of heat through the mounting
studs and standoffs as they contact the motherboard. As
described in the Package Integrity/Mounting Guidelines
section, the module should be secured to the motherboard
using 2-56 nuts (washer use is optional). The torque on the nuts
should not exceed 32 inch ounces. Use of a thermal grease at the
standoffs will result in better thermal coupling between the
board and module. Depending on the ambient conditions, air
flow may be necessary to ensure the components in the module
do not exceed their maximum operating temperature. In terms
of reliability, the most sensitive component has a maximum
junction temperature rating of 125°C.
Figures 21 and 22 provide a basic guideline for two key thermal
management decisions: the use of thermal interface material
between the module bottom cover/mother board and airflow.
Figure 21 characterizes the typical thermal profile of an
AD12400 that is not using thermal interface material. Figure 22
provides the same information for a configuration that uses
gap-filling thermal interface material (in this case Thermagon
T-Flex 600 series, 0.040” thickness was used). One can see from
these profiles that the maximum die temperature is reduced by
approximately 2°C when thermal interface material is used.
Figures 21 and 22 also provide a guideline for determining the
airflow requirements for given ambient conditions. For example,
a goal of 120°C die temperature in a 40°C ambient environment
without the use of thermal interface material would require an
air flow of 100 LFM. See the AD12400 Thermal Management
and Measurement Application Note for further details.
From a channel matching perspective, the most important
consideration will be external thermal influences. It is possible
for thermal imbalances in the end application to adversely affect
the dynamic performance. Due to the temperature dependence
of the image spur, substantial deviation from the factory
calibration conditions can have a detrimental effect.
Unbalanced thermal influences can cause gradients across the
module, and performance degradation may result. Examples of
unbalanced thermal influences may include large heat
dissipating elements near one side of the AD12400 or
obstructed air flow that does not flow uniformly across the
module. The thermal sensitivity of the module can be affected
by a change in thermal gradient across the module of 2°C.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| AD124-00 | 功能描述:SENSOR MAG SW 28G CROS AX 8-MSOP RoHS:否 類別:傳感器，轉(zhuǎn)換器 >> 磁性 - 霍爾效應(yīng)，數(shù)字式開關(guān)，線性，羅盤 (IC) 系列:AD 標(biāo)準(zhǔn)包裝:1 系列:- 傳感范圍:20mT ~ 80mT 類型:旋轉(zhuǎn) 電源電壓:4.5 V ~ 5.5 V 電流 - 電源:15mA 電流 - 輸出（最大）:- 輸出類型:數(shù)字式，PWM，8.5 位串行 特點(diǎn):可編程 工作溫度:-40°C ~ 150°C 封裝/外殼:20-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:20-SSOP 包裝:Digi-Reel® 其它名稱:AS5132-HSST-500DKR |
| AD12400/KIT | 制造商:AD 制造商全稱:Analog Devices 功能描述:12-Bit 400 MSPS A/D Converter |
| AD12400BWS | 制造商:Analog Devices 功能描述:ADC DUAL 400MSPS 12-BIT PARALLEL - Bulk |
| AD124-00E | 功能描述:SENSOR MAG SW 28G CROS AX 8-MSOP 制造商:nve corp/sensor products 系列:AD 包裝:管件 零件狀態(tài):有效 功能:全極開關(guān) 技術(shù):霍爾效應(yīng) 極化:任意一種 感應(yīng)范圍:±3.4mT 跳閘，±1.4mT 釋放 測試條件:-40°C ~ 125°C 電壓 - 電源:4.5 V ~ 30 V 電流 - 電源（最大值）:4.5mA 電流 - 輸出（最大值）:20mA 輸出類型:開路集電極 特性:- 工作溫度:-40°C ~ 125°C（TA） 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商器件封裝:8-MSOP 標(biāo)準(zhǔn)包裝:1,000 |
| AD12400JWS | 制造商:Analog Devices 功能描述: |
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