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參數(shù)資料
| 型號： | AD5203ARZ100-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 6/12頁 |
| 文件大小： | 0K |
| 描述： | IC POT DGTL QUAD 64POS 24SOIC |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 接片： | 64 |
| 電阻（歐姆）： | 100k |
| 電路數(shù)： | 4 |
| 溫度系數(shù)： | 標(biāo)準(zhǔn)值 700 ppm/°C |
| 存儲器類型： | 易失 |
| 接口： | 4 線 SPI（芯片選擇） |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-SOIC |
| 包裝： | 帶卷 (TR) |
–3–
REV. 0
AD5203
NOTES
1Typicals represent average readings at +25
°C and V
DD = +5 V.
2Resistor position nonlinearity error R-INL is the deviation from an ideal value measured between the maximum resistance and the minimum resistance wiper posi-
tions. R-DNL measures the relative step change from ideal between successive tap positions. Parts are guaranteed monotonic. See Figure 27 test circuit. I W = VDD/R
for both VDD = +3 V or VDD = +5 V.
3V
AB = VDD, Wiper (VW) = No connect.
4INL and DNL are measured at V
W with the RDAC configured as a potentiometer divider similar to a voltage output D/A converter. V A = VDD and VB = 0 V.
DNL specification limits of
±1 LSB maximum are guaranteed monotonic operating conditions. See Figure 26 test circuit.
5Resistor terminals A, B, W have no limitations on polarity with respect to each other.
6Guaranteed by design and not subject to production test.
7Measured at the AX terminals. All AX terminals are open-circuited in shutdown mode.
8Worst case supply current consumed when all logic-input levels set at 2.4 V, standard characteristic of CMOS logic. See Figure 19 for a plot of I
DD vs. logic voltage
inputs result in minimum power dissipation.
9P
DISS is calculated from (IDD × V DD). CMOS logic level inputs result in minimum power dissipation.
10All dynamic characteristics use V
DD = +5 V.
11Measured at a V
W pin where an adjacent VW pin is making a full-scale voltage change.
12See timing diagrams for location of measured values. All input control voltages are specified with t
R = tF = 1 ns (10% to 90% of VDD) and timed from a voltage level
of 1.6 V. Switching characteristics are measured using both VDD = +3 V or +5 V. Input logic should have a 1 V/ s minimum slew rate.
13Propagation delay depends on value of V
DD, RL and CL. See Operation section.
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C, unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
VA, VB, VW to GND . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, VDD
IAB, IAW, IBW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±20 mA
Digital Input and Output Voltage to GND . . . . . . . 0 V, +8 V
Operating Temperature Range . . . . . . . . . . . –40
°C to +85°C
Maximum Junction Temperature (TJ MAX) . . . . . . . . +150
°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . +300
°C
Package Power Dissipation . . . . . . . . . . . . . . (TJ max–TA)/
θ
JA
Thermal Resistance
θ
JA
P-DIP (N-24) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
°C/W
SOIC (SOL-24) . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
°C/W
TSSOP-24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
°C/W
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Table I. Serial-Data Word Format
ADDR
DATA
B7
B6
B5
B4
B3
B2
B1
B0
A1
A0
D5
D4
D3
D2
D1
D0
MSB
LSB
MSB
LSB
27
26
25
20
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD5203 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
SDI
CLK
CS
VOUT
1
0
1
0
1
0
VDD
0V
D0
D1
D2
D3
D4
D5
A0
A1
DAC REGISTER LOAD
Figure 1a. Timing Diagram
CLK
VOUT
1
0
1
0
1
0
VDD
0V
SDI
(DATA IN)
SDO
(DATA OUT)
CS
1
0
Ax OR Dx
A'x OR D'x
tDS
tDH
tPD MAX
tPD MIN
tCH
tCS1
tCL
tCSS
tCSH
1 LSB
1 LSB ERROR BAND
tCSW
tS
A'x OR D'x
Figure 1b. Detail Timing Diagram
VOUT
VDD
0V
RS
1
0
1 LSB
1 LSB ERROR BAND
tS
tRS
Figure 1c. Reset Timing Diagram
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