TA = 25°C, unless otherwis" />
參數(shù)資料
型號: AD5206BR50-REEL
廠商: Analog Devices Inc
文件頁數(shù): 17/20頁
文件大?。?/td> 0K
描述: IC DGTL POT 6CH 256POS 24-SOIC
標(biāo)準(zhǔn)包裝: 1,000
接片: 256
電阻(歐姆): 50k
電路數(shù): 6
溫度系數(shù): 標(biāo)準(zhǔn)值 700 ppm/°C
存儲器類型: 易失
接口: 3 線串行(芯片選擇)
電源電壓: 2.7 V ~ 5.5 V,±2.3 V ~ 2.7 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SOIC W
包裝: 帶卷 (TR)
AD5204/AD5206
Rev. C | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 2.
Parameter
Rating
VDD to GND
0.3 V to +7 V
VSS to GND
0 V to 7 V
VDD to VSS
7 V
VA, VB, VW to GND
VSS, VDD
IA, IB, IW
±20 mA
Continuous
10 kΩ End-to-End Resistance
±11 mA
50 kΩ and 100 kΩ End-to-End
Resistance
±2.5 mA
Digital Input and Output Voltage
to GND
0.3 V to (VDD + 0.3 V) or 7 V
(whichever is less)
Operating Temperature Range
40°C to +85°C
Maximum Junction Temperature
(TJ max)
150°C
Storage Temperature
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
Package Power Dissipation
(TJ max TA)/θJA
Thermal Resistance, θJA2
PDIP (N-24-1)
63°C/W
SOIC (RW-24)
52°C/W
TSSOP (RU-24)
50°C/W
LFCSP (CP-32-3)
32.5°C/W
ESD CAUTION
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Thermal resistance (JEDEC 4-layer (2S2P) board). Paddle soldered to board.
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