Data Sheet
AD5231
Rev. D | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameters
Ratings
VDD to GND
–0.3 V, +7 V
VSS to GND
+0.3 V, 7 V
VDD to VSS
7 V
VA, VB, VW to GND
VSS 0.3 V, VDD + 0.3 V
A–B, A–W, B–W
±20 mA
Continuous
±2 mA
Digital Input and Output Voltage
to GND
0.3 V, VDD + 0.3 V
Operating Temperature Range
240°C to +85°C
Maximum Junction Temperature
(TJ max)
150°C
Storage Temperature
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
Thermal Resistance
Junction-to-Ambient (θJA),TSSOP-16
150°C/W
Junction-to-Case (θJC), TSSOP-16
28°C/W
Package Power Dissipation
(TJ max TA)/θJA
1
Maximum terminal current is bounded by the maximum current handling of the
switches, maximum power dissipation of the package, and maximum applied
voltage across any two of the A, B, and W terminals at a given resistance.
2
Includes programming of nonvolatile memory.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION