- 您現(xiàn)在的位置：買賣IC網 > PDF目錄9010 > AD5304ARMZ-REEL7 (Analog Devices Inc)IC DAC 8BIT QUAD VOUT 10MSOP PDF資料下載
參數(shù)資料
| 型號： | AD5304ARMZ-REEL7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 13/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 8BIT QUAD VOUT 10MSOP |
| 產品培訓模塊： | Data Converter Fundamentals DAC Architectures |
| 標準包裝： | 1 |
| 設置時間： | 6µs |
| 位數(shù)： | 8 |
| 數(shù)據接口： | 串行 |
| 轉換器數(shù)目： | 4 |
| 電壓電源： | 單電源 |
| 功率耗散（最大）： | 4.5W |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-TFSOP，10-MSOP（0.118"，3.00mm 寬） |
| 供應商設備封裝： | 10-MSOP |
| 包裝： | 標準包裝 |
| 輸出數(shù)目和類型： | 4 電壓，單極；4 電壓，雙極 |
| 采樣率（每秒）： | 167k |
| 產品目錄頁面： | 782 (CN2011-ZH PDF) |
| 其它名稱： | AD5304ARMZ-REEL7DKR |
AD5304/AD5314/AD5324
Data Sheet
Rev. H | Page 20 of 24
POWER SUPPLY BYPASSING AND GROUNDING
In any circuit where accuracy is important, careful consideration of
the power supply and ground return layout helps to ensure the
rated performance. The printed circuit board on which the
AD5304/AD5314/AD5324 is mounted is designed so that the
analog and digital sections are separated and confined to certain
areas of the board. If the AD5304/AD5314/AD5324 are in a
system where multiple devices require an AGND-to-DGND
connection, the connection is made at one point only. The star
ground point is established as close as possible to the device. The
AD5304/AD5314/AD5324 has ample supply bypassing of 10 μF in
parallel with 0.1 μF on the supply located as close to the package as
possible, ideally right up against the device. The 10 μF capacitors
are the tantalum bead type. The 0.1 μF capacitor has low effective
series resistance (ESR) and effective series inductance (ESI), like
the common ceramic types that provide a low impedance path
to ground at high frequencies, to handle transient currents due
to internal logic switching.
The power supply lines of the AD5304/AD5314/AD5324 use as
large a trace as possible to provide low impedance paths and reduce
the effects of glitches on the power supply line. Fast switching
signals such as clocks are shielded with digital ground to avoid
radiating noise to other parts of the board, and are never run
near the reference inputs. Avoid crossover of digital and analog
signals. Traces on opposite sides of the board run at right angles
to each other. This reduces the effects of feedthrough through
the board. A microstrip technique is by far the best, but is not
always possible with a double-sided board. In this technique,
the component side of the board is dedicated to a ground plane
while signal traces are placed on the solder side.
Table 7. Overview of AD53xx Serial Devices
Part No.
Resolution
No. of DACs
DNL
Interface
Settling Time (μs)
Package
Pins
SINGLES
AD5300
8
1
±0.25
SPI
4
SOT-23, MSOP
6, 8
AD5310
10
1
±0.5
SPI
6
SOT-23, MSOP
6, 8
AD5320
12
1
±1.0
SPI
8
SOT-23, MSOP
6, 8
AD5301
8
1
±0.25
2-Wire
6
SOT-23, MSOP
6, 8
AD5311
10
1
±0.5
2-Wire
7
SOT-23, MSOP
6, 8
AD5321
12
1
±1.0
2-Wire
8
SOT-23, MSOP
6, 8
DUALS
AD5302
8
2
±0.25
SPI
6
MSOP
8
AD5312
10
2
±0.5
SPI
7
MSOP
8
AD5322
12
2
±1.0
SPI
8
MSOP
8
AD5303
8
2
±0.25
SPI
6
TSSOP
16
AD5313
10
2
±0.5
SPI
7
TSSOP
16
AD5323
12
2
±1.0
SPI
8
TSSOP
16
QUADS
AD5304
8
4
±0.25
SPI
6
MSOP, LFCSP
10
AD5314
10
4
±0.5
SPI
7
MSOP, LFCSP
10
AD5324
12
4
±1.0
SPI
8
MSOP, LFCSP
10
AD5305
8
4
±0.25
2-Wire
6
MSOP
10
AD5315
10
4
±0.5
2-Wire
7
MSOP
10
AD5325
12
4
±1.0
2-Wire
8
MSOP
10
AD5306
8
4
±0.25
2-Wire
6
TSSOP
16
AD5316
10
4
±0.5
2-Wire
7
TSSOP
16
AD5326
12
4
±1.0
2-Wire
8
TSSOP
16
AD5307
8
4
±0.25
SPI
6
TSSOP
16
AD5317
10
4
±0.5
SPI
7
TSSOP
16
AD5327
12
4
±1.0
SPI
8
TSSOP
16
OCTALS
AD5308
8
±0.25
SPI
6
TSSOP
16
AD5318
10
8
±0.5
SPI
7
TSSOP
16
AD5328
12
8
±1.0
SPI
8
TSSOP
16
相關PDF資料 |
PDF描述 |
|---|---|
| MS27473E22F2S | CONN PLUG 85POS STRAIGHT W/SCKT |
| VE-2N3-MW-F2 | CONVERTER MOD DC/DC 24V 100W |
| IDT23S09E-1DCGI | IC CLK BUFF ZD 16SOIC |
| MS27656T25B35H | CONN RCPT 128POS WALL MNT W/PINS |
| VE-2N3-MW-F1 | CONVERTER MOD DC/DC 24V 100W |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AD5304BCPZ-REEL7 | 功能描述:IC DAC 8BIT QUAD VOUT 10LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 產品培訓模塊:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色產品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 標準包裝:91 系列:- 設置時間:4µs 位數(shù):10 數(shù)據接口:MICROWIRE?，串行，SPI? 轉換器數(shù)目:8 電壓電源:單電源 功率耗散（最大）:2.7mW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應商設備封裝:14-DFN-EP（4x3） 包裝:管件 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:* |
| AD5304BRM | 功能描述:IC DAC 8BIT QUAD VOUT 10-MSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 標準包裝:2,400 系列:- 設置時間:- 位數(shù):18 數(shù)據接口:串行 轉換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應商設備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| AD5304BRM-REEL | 功能描述:IC DAC 8BIT QUAD VOUT 10-MSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 標準包裝:2,400 系列:- 設置時間:- 位數(shù):18 數(shù)據接口:串行 轉換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應商設備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| AD5304BRM-REEL7 | 功能描述:IC DAC 8BIT QUAD VOUT 10-MSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 產品培訓模塊:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色產品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 標準包裝:91 系列:- 設置時間:4µs 位數(shù):10 數(shù)據接口:MICROWIRE?，串行，SPI? 轉換器數(shù)目:8 電壓電源:單電源 功率耗散（最大）:2.7mW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應商設備封裝:14-DFN-EP（4x3） 包裝:管件 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:* |
| AD5304BRMZ | 功能描述:IC DAC 8BIT QUAD VOUT 10-MSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:50 系列:- 設置時間:4µs 位數(shù):12 數(shù)據接口:串行 轉換器數(shù)目:2 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應商設備封裝:8-uMAX 包裝:管件 輸出數(shù)目和類型:2 電壓，單極 采樣率（每秒）:* 產品目錄頁面:1398 (CN2011-ZH PDF) |
發(fā)布緊急采購，3分鐘左右您將得到回復。