參數(shù)資料
型號(hào)： AD5323BRU-REEL7
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 17/28頁(yè)
文件大?。?/td> 0K
描述： IC DAC 12BIT SRL 16TSSOP
產(chǎn)品培訓(xùn)模塊： Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝： 1,000
設(shè)置時(shí)間： 8µs
位數(shù)： 12
數(shù)據(jù)接口： 串行
轉(zhuǎn)換器數(shù)目： 2
電壓電源： 單電源
功率耗散（最大）： 2.5mW
工作溫度： -40°C ~ 105°C
安裝類型： 表面貼裝
封裝/外殼： 16-TSSOP（0.173"，4.40mm 寬）
供應(yīng)商設(shè)備封裝： 16-TSSOP
包裝： 帶卷 (TR)
輸出數(shù)目和類型： 2 電壓，單極；2 電壓，雙極
采樣率（每秒）： 125k
AD5303/AD5313/AD5323
Rev. B | Page 24 of 28
00
47
2-
0
47
SCLK
DIN
DB15
DB0
DB15
DB0
DB15
DB0
SDO
INPUT WORD FOR DAC N
INPUT WORD FOR DAC (N+1)
UNDEFINED
INPUT WORD FOR DAC N
SCLK
SDO
t1
t2
t3
t4
t6
t5
t8
t14
t15
t13
t12
VIL
VIH
SYNC
Figure 47. Daisy-Chaining Timing Diagram
POWER SUPPLY BYPASSING AND GROUNDING
In any circuit where accuracy is important, careful considera-
tion of the power supply and ground return layout helps to
ensure the rated performance. The printed circuit board on
which the AD5303/AD5313/AD5323 are mounted should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. If the AD5303/
AD5313/AD5323 are in a system where multiple devices
require an AGND-to-DGND connection, the connection
should be made at one point only. The star ground point
should be established as close as possible to the AD5303/
AD5313/AD5323. The AD5303/AD5313/AD5323 should
have ample supply bypassing of 10 μF in parallel with 0.1 μF
on the supply located as close to the package as possible, ideally
right up against the device. Use 10 μF capacitors that are of the
tantalum bead type. The 0.1 μF capacitor should have low
effective series resistance (ESR) and effective series inductance
(ESI), like the common ceramic types that provide a low
impedance path to ground at high frequencies to handle
transient currents due to internal logic switching.
The power supply lines of the AD5303/AD5313/AD5323 should
use as large a trace as possible to provide low impedance paths
and reduce the effects of glitches on the power supply line. Fast
switching signals such as clocks should be shielded with digital
ground to avoid radiating noise to other parts of the board, and
should never be run near the reference inputs. Avoid crossover
of digital and analog signals. Traces on opposite sides of the
board should run at right angles to each other. This reduces
the effects of feedthrough through the board. A microstrip
technique is by far the best, but is not always possible with a
double-sided board. In this technique, the component side of
the board is dedicated to the ground plane while signal traces
are placed on the solder side.
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AD5323BRUZ-REEL 功能描述:IC DAC 12BIT DUAL R-R 16-TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:LTC263x 12-, 10-, and 8-Bit VOUT DAC Family 特色產(chǎn)品:LTC2636 - Octal 12-/10-/8-Bit SPI VOUT DACs with 10ppm/°C Reference 標(biāo)準(zhǔn)包裝:91 系列:- 設(shè)置時(shí)間:4µs 位數(shù):10 數(shù)據(jù)接口:MICROWIRE?，串行，SPI? 轉(zhuǎn)換器數(shù)目:8 電壓電源:單電源 功率耗散（最大）:2.7mW 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:14-DFN-EP（4x3） 包裝:管件 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:*
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